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SN74LVTH374PWLE

产品描述3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-TSSOP -40 to 85
产品类别逻辑    逻辑   
文件大小849KB,共20页
制造商Texas Instruments(德州仪器)
官网地址http://www.ti.com.cn/
敬请期待 详细参数 选型对比

SN74LVTH374PWLE概述

3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-TSSOP -40 to 85

SN74LVTH374PWLE规格参数

参数名称属性值
Brand NameTexas Instruments
是否无铅含铅
是否Rohs认证不符合
厂商名称Texas Instruments(德州仪器)
零件包装代码TSSOP
包装说明TSSOP, TSSOP20,.25
针数20
Reach Compliance Codenot_compliant
系列LVT
JESD-30 代码R-PDSO-G20
长度6.5 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大频率@ Nom-Sup160000000 Hz
最大I(ol)0.064 A
位数8
功能数量1
端口数量2
端子数量20
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP20,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TR
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
最大电源电流(ICC)5 mA
Prop。Delay @ Nom-Sup4.5 ns
传播延迟(tpd)5 ns
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
触发器类型POSITIVE EDGE
宽度4.4 mm

SN74LVTH374PWLE相似产品对比

SN74LVTH374PWLE 5962-9951001QRA 5962-9951001Q2A SNJ54LVTH374J SN74LVTH374DBLE SNJ54LVTH374FK SN54LVTH374FK SN54LVTH374J SN54LVTH374W SN54LVTH374WR
描述 3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-TSSOP -40 to 85 LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-LCCC -55 to 125 LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-SSOP -40 to 85 Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-LCCC -55 to 125 LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20 LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20 LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20 LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20
包装说明 TSSOP, TSSOP20,.25 DIP, DIP20,.3 QCCN, LCC20,.35SQ DIP, DIP20,.3 SSOP, SSOP20,.3 QCCN, LCC20,.35SQ QCCN, DIP, DFP, DFP,
Reach Compliance Code not_compliant _compli not_compliant not_compliant not_compliant not_compliant unknown unknown unknown unknown
系列 LVT LVT LVT LVT LVT LVT LVT LVT LVT LVT
JESD-30 代码 R-PDSO-G20 R-GDIP-T20 S-CQCC-N20 R-GDIP-T20 R-PDSO-G20 S-CQCC-N20 S-CQCC-N20 R-GDIP-T20 R-GDFP-F20 R-GDFP-F20
长度 6.5 mm 24.195 mm 8.89 mm 24.195 mm 7.2 mm 8.89 mm 8.89 mm 24.195 mm 13.09 mm 13.09 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 8 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2 2 2 2
端子数量 20 20 20 20 20 20 20 20 20 20
最高工作温度 85 °C 125 °C 125 °C 125 °C 85 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -55 °C -55 °C -55 °C -40 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 TSSOP DIP QCCN DIP SSOP QCCN QCCN DIP DFP DFP
封装形状 RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE CHIP CARRIER IN-LINE SMALL OUTLINE, SHRINK PITCH CHIP CARRIER CHIP CARRIER IN-LINE FLATPACK FLATPACK
传播延迟(tpd) 5 ns 5.6 ns 5.6 ns 5.6 ns 5 ns 5.6 ns 4.6 ns 4.6 ns 4.6 ns 4.6 ns
认证状态 Not Qualified Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 5.08 mm 2.03 mm 5.08 mm 2 mm 2.03 mm 2.03 mm 5.08 mm 2.54 mm 2.54 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES NO YES NO YES YES YES NO YES YES
技术 BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL MILITARY MILITARY MILITARY INDUSTRIAL MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 GULL WING THROUGH-HOLE NO LEAD THROUGH-HOLE GULL WING NO LEAD NO LEAD THROUGH-HOLE FLAT FLAT
端子节距 0.65 mm 2.54 mm 1.27 mm 2.54 mm 0.65 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL QUAD DUAL DUAL QUAD QUAD DUAL DUAL DUAL
宽度 4.4 mm 7.62 mm 8.89 mm 7.62 mm 5.3 mm 8.89 mm 8.89 mm 7.62 mm 6.92 mm 6.92 mm
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 - - - -
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 - - - -
厂商名称 Texas Instruments(德州仪器) - - - Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
零件包装代码 TSSOP DIP QLCC DIP SSOP QLCC - - - DFP
针数 20 20 20 20 20 20 - - - 20
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF - -
最大I(ol) 0.064 A 0.048 A 0.048 A 0.048 A 0.064 A 0.048 A - - - -
封装等效代码 TSSOP20,.25 DIP20,.3 LCC20,.35SQ DIP20,.3 SSOP20,.3 LCC20,.35SQ - - - -
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - - - -
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - - - -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - - - -
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE - - - -

 
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