ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CQFP44, CERQUAD-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Signal Processing Technologies |
包装说明 | CERQUAD-44 |
Reach Compliance Code | unknown |
最小模拟输入电压 | -2 V |
转换器类型 | ADC, FLASH METHOD |
JESD-30 代码 | S-GQFP-G44 |
JESD-609代码 | e0 |
最大线性误差 (EL) | 0.293% |
标称负供电电压 | -5.2 V |
模拟输入通道数量 | 1 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 44 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, 8 BITS |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | QFP |
封装等效代码 | QFP44,.7SQ,40 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | -5.2 V |
认证状态 | Not Qualified |
采样速率 | 150 MHz |
表面贴装 | YES |
技术 | ECL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1 mm |
端子位置 | QUAD |
SPT7710AMQ | SPT7710AIJ | SPT7710BCU | SPT7710AMQ/883 | |
---|---|---|---|---|
描述 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CQFP44, CERQUAD-44 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CDIP42, SIDE BRAZED, CERAMIC, DIP-42 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, DIE | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CQFP44, CERQUAD-44 |
包装说明 | CERQUAD-44 | SIDE BRAZED, CERAMIC, DIP-42 | DIE | CERQUAD-44 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
最小模拟输入电压 | -2 V | -2 V | -2 V | -2 V |
转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 代码 | S-GQFP-G44 | R-CDIP-T42 | X-XUUC-N | S-CQFP-G44 |
最大线性误差 (EL) | 0.293% | 0.293% | 0.3711% | 0.293% |
标称负供电电压 | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
模拟输入通道数量 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
最高工作温度 | 125 °C | 85 °C | 25 °C | 125 °C |
最低工作温度 | -55 °C | -25 °C | 25 °C | -55 °C |
输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
封装等效代码 | QFP44,.7SQ,40 | DIP42,.6 | DIE OR CHIP | QFP44,.7SQ,40 |
封装形状 | SQUARE | RECTANGULAR | UNSPECIFIED | SQUARE |
封装形式 | FLATPACK | IN-LINE | UNCASED CHIP | FLATPACK |
电源 | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 150 MHz | 125 MHz | 125 MHz | 150 MHz |
表面贴装 | YES | NO | YES | YES |
技术 | ECL | ECL | ECL | ECL |
温度等级 | MILITARY | OTHER | OTHER | MILITARY |
端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING |
端子位置 | QUAD | DUAL | UPPER | QUAD |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 |
JESD-609代码 | e0 | e0 | - | e0 |
端子数量 | 44 | 42 | - | 44 |
封装代码 | QFP | DIP | - | QFP |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
端子节距 | 1 mm | 2.54 mm | - | 1 mm |
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