Bus Driver, CMOS Series, 1-Func, 10-Bit, True Output, CMOS, PDIP24, 0.300 INCH, SKINNY, SLIM, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknow |
| 系列 | CMOS |
| JESD-30 代码 | R-PDIP-T24 |
| 长度 | 30.734 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 15.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| AM29C821APC | AM29C821AJC | AM29C821ASC | AM29C823APC | AM29C823ASC | AM29C821A/BLA | |
|---|---|---|---|---|---|---|
| 描述 | Bus Driver, CMOS Series, 1-Func, 10-Bit, True Output, CMOS, PDIP24, 0.300 INCH, SKINNY, SLIM, PLASTIC, DIP-24 | Bus Driver, CMOS Series, 1-Func, 10-Bit, True Output, CMOS, PQCC28, PLASTIC, LCC-28 | Bus Driver, CMOS Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, PLASTIC, SOIC-24 | CMOS SERIES, 9-BIT DRIVER, TRUE OUTPUT, PDIP24, 0.300 INCH, SKINNY, SLIM, PLASTIC, DIP-24 | CMOS SERIES, 9-BIT DRIVER, TRUE OUTPUT, PDSO24, PLASTIC, SOIC-24 | Bus Driver, CMOS Series, 1-Func, 10-Bit, True Output, CMOS, CDIP24, 0.300 INCH, SKINNY, SLIM, CERAMIC, DIP-24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QLCC | SOIC | DIP | SOIC | DIP |
| 包装说明 | DIP, | QCCJ, | SOP, | DIP, | SOP, | DIP, |
| 针数 | 24 | 28 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknow | unknow | unknow | unknown | unknown | unknown |
| 系列 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| JESD-30 代码 | R-PDIP-T24 | S-PQCC-J28 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | R-GDIP-T24 |
| 长度 | 30.734 mm | 11.5062 mm | 15.4 mm | 30.734 mm | 15.4 mm | 31.9405 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 10 | 10 | 10 | 9 | 9 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 28 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCJ | SOP | DIP | SOP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟（tpd） | 15.5 ns | 15.5 ns | 15.5 ns | 15.5 ns | 15.5 ns | 17.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | COMMERCIAL | Not Qualified |
| 座面最大高度 | 5.08 mm | 4.57 mm | 3 mm | 5.08 mm | 3 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 11.5062 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.62 mm |
| 端子面层 | - | TIN LEAD | - | NOT SPECIFIED | NOT SPECIFIED | TIN LEAD |
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