A/MU-LAW, PCM CODEC, PDSO24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Winbond(华邦电子) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.300 INCH, PLASTIC, SOP-24 |
| 针数 | 24 |
| Reach Compliance Code | _compli |
| 其他特性 | IT ALSO REQUIRES 5V SUPPLY |
| 压伸定律 | A/MU-LAW |
| 滤波器 | YES |
| 最大增益公差 | 1.6 dB |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 长度 | 12.8 mm |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3,5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大压摆率 | 0.008 mA |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 电信集成电路类型 | PCM CODEC |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| W6811IS | W6811 | W6811IE | W6811IR | W6811IEG | W6811ISG | W6811IWG | W6811IW | W6811IRG | W6811_05 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | A/MU-LAW, PCM CODEC, PDSO24 | A/MU-LAW, PCM CODEC, PDSO24 | A/MU-LAW, PCM CODEC, PDSO24 | A/MU-LAW, PCM CODEC, PDSO24 | A/MU-LAW, PCM CODEC, PDSO24 | A/MU-LAW, PCM CODEC, PDSO24 | A/MU-LAW, PCM CODEC, PDSO24 | IC,PCM CODEC,SINGLE,TSSOP,24PIN,PLASTIC | A/MU-LAW, PCM CODEC, PDSO24 | A/MU-LAW, PCM CODEC, PDSO24 |
| 滤波器 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 表面贴装 | YES | YES | NO | YES | NO | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | - |
| 厂商名称 | Winbond(华邦电子) | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | - |
| 零件包装代码 | SOIC | - | DIP | SSOP | DIP | SOIC | SOIC | SOIC | SSOP | - |
| 包装说明 | 0.300 INCH, PLASTIC, SOP-24 | - | 0.300 INCH, PLASTIC, DIP-24 | 0.209 INCH, PLASTIC, SSOP-24 | DIP, DIP24,.3 | SOP, SOP24,.4 | TSSOP, TSSOP24,.25 | 4.40 X 7.80 MM, PLASTIC, TSSOP1-24 | SSOP, SSOP24,.3 | - |
| 针数 | 24 | - | 24 | 24 | 24 | 24 | 24 | 24 | 24 | - |
| Reach Compliance Code | _compli | - | _compli | _compli | unknow | unknow | unknow | _compli | unknow | - |
| 其他特性 | IT ALSO REQUIRES 5V SUPPLY | - | IT ALSO REQUIRES 5V SUPPLY | IT ALSO REQUIRES 5V SUPPLY | IT ALSO REQUIRES 5V SUPPLY | IT ALSO REQUIRES 5V SUPPLY | IT ALSO REQUIRES 5V SUPPLY | IT ALSO REQUIRES 5V SUPPLY | IT ALSO REQUIRES 5V SUPPLY | - |
| 压伸定律 | A/MU-LAW | - | A/MU-LAW | A/MU-LAW | A/MU-LAW | A/MU-LAW | A/MU-LAW | A/MU-LAW | A/MU-LAW | - |
| 最大增益公差 | 1.6 dB | - | 1.6 dB | 1.6 dB | 1.6 dB | 1.6 dB | 1.6 dB | 1.6 dB | 1.6 dB | - |
| JESD-30 代码 | R-PDSO-G24 | - | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - |
| 长度 | 12.8 mm | - | 31.95 mm | 8.2 mm | 31.95 mm | 12.8 mm | 7.8 mm | 7.8 mm | 8.2 mm | - |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | - | DIP | SSOP | DIP | SOP | TSSOP | TSSOP | SSOP | - |
| 封装等效代码 | SOP24,.4 | - | DIP24,.3 | SSOP24,.3 | DIP24,.3 | SOP24,.4 | TSSOP24,.25 | TSSOP24,.25 | SSOP24,.3 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | - |
| 电源 | 3.3,5 V | - | 3.3,5 V | 3.3,5 V | 3.3,5 V | 3.3,5 V | 3.3,5 V | 3.3,5 V | 3.3,5 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 2.65 mm | - | 4.45 mm | 2 mm | 4.45 mm | 2.65 mm | 1.2 mm | 1.2 mm | 2 mm | - |
| 最大压摆率 | 0.008 mA | - | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA | - |
| 标称供电电压 | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| 电信集成电路类型 | PCM CODEC | - | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | - |
| 端子节距 | 1.27 mm | - | 2.54 mm | 0.65 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 | - |
| 宽度 | 7.5 mm | - | 7.62 mm | 5.3 mm | 7.62 mm | 7.5 mm | 4.4 mm | 4.4 mm | 5.3 mm | - |
嵌入式系统
ADI参考电路
stm32/stm8
Microchip MCU
嵌入式系统
微控制器 MCU
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