RISC Microprocessor, 16-Bit, 27.8MHz, CMOS, CPGA68
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | PGA, PGA68,11X11 |
Reach Compliance Code | unknow |
位大小 | 16 |
JESD-30 代码 | S-XPGA-P68 |
JESD-609代码 | e0 |
端子数量 | 68 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | PGA |
封装等效代码 | PGA68,11X11 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
电源 | 5 V |
速度 | 27.8 MHz |
最大压摆率 | 170 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG |
端子节距 | 2.54 mm |
端子位置 | PERPENDICULAR |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
Base Number Matches | 1 |
AM29C117-1GCB | AM29C117-1GC | AM29C117-1JC | AM29C117-2GC | AM29C117-2GCB | AM29C117-2JC | AM29C117GC | AM29C117GCB | AM29C117JC | |
---|---|---|---|---|---|---|---|---|---|
描述 | RISC Microprocessor, 16-Bit, 27.8MHz, CMOS, CPGA68 | RISC Microprocessor, 16-Bit, 27.8MHz, CMOS, CPGA68 | RISC Microprocessor, 16-Bit, 27.8MHz, CMOS, PQCC68 | RISC Microprocessor, 16-Bit, 28.6MHz, CMOS, CPGA68 | RISC Microprocessor, 16-Bit, 28.6MHz, CMOS, CPGA68 | RISC Microprocessor, 16-Bit, 28.6MHz, CMOS, PQCC68 | RISC Microprocessor, 16-Bit, 19.6MHz, CMOS, CPGA68 | RISC Microprocessor, 16-Bit, 19.6MHz, CMOS, CPGA68 | RISC Microprocessor, 16-Bit, 19.6MHz, CMOS, PQCC68 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
JESD-30 代码 | S-XPGA-P68 | S-XPGA-P68 | S-PQCC-J68 | S-XPGA-P68 | S-XPGA-P68 | S-PQCC-J68 | S-XPGA-P68 | S-XPGA-P68 | S-PQCC-J68 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
封装代码 | PGA | PGA | QCCJ | PGA | PGA | QCCJ | PGA | PGA | QCCJ |
封装等效代码 | PGA68,11X11 | PGA68,11X11 | LDCC68,1.0SQ | PGA68,11X11 | PGA68,11X11 | LDCC68,1.0SQ | PGA68,11X11 | PGA68,11X11 | LDCC68,1.0SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | CHIP CARRIER | GRID ARRAY | GRID ARRAY | CHIP CARRIER | GRID ARRAY | GRID ARRAY | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
速度 | 27.8 MHz | 27.8 MHz | 27.8 MHz | 28.6 MHz | 28.6 MHz | 28.6 MHz | 19.6 MHz | 19.6 MHz | 19.6 MHz |
最大压摆率 | 170 mA | 170 mA | 170 mA | 170 mA | 170 mA | 170 mA | 170 mA | 170 mA | 170 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | NO | NO | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG | PIN/PEG | J BEND | PIN/PEG | PIN/PEG | J BEND | PIN/PEG | PIN/PEG | J BEND |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
包装说明 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | QCCJ, LDCC68,1.0SQ | PGA, PGA68,11X11 | PGA, PGA68,11X11 | QCCJ, LDCC68,1.0SQ | - | PGA, PGA68,11X11 | QCCJ, LDCC68,1.0SQ |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
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