D Latch, 1-Func, 10-Bit, CMOS, PDIP24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP24,.3 |
Reach Compliance Code | unknow |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D LATCH |
最大I(ol) | 0.024 A |
位数 | 10 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
Prop。Delay @ Nom-Su | 11 ns |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
AM29C841PCB | AM29C841DC | AM29C843DC | AM29C843PCB | AM29C941DC | AM29C943PCB | AM29C943DC | AM29C941PCB | |
---|---|---|---|---|---|---|---|---|
描述 | D Latch, 1-Func, 10-Bit, CMOS, PDIP24 | D Latch, 1-Func, 10-Bit, CMOS, CDIP24 | D Latch, 1-Func, 9-Bit, CMOS, CDIP24 | D Latch, 1-Func, 9-Bit, CMOS, PDIP24 | D Latch, 1-Func, 10-Bit, CMOS, CDIP24 | D Latch, 1-Func, 9-Bit, CMOS, PDIP24 | D Latch, 1-Func, 9-Bit, CMOS, CDIP24 | D Latch, 1-Func, 10-Bit, CMOS, PDIP24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
JESD-30 代码 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
位数 | 10 | 10 | 9 | 9 | 10 | 9 | 9 | 10 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Prop。Delay @ Nom-Su | 11 ns | 11 ns | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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