RB521S30
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
www.onsemi.com
•
•
•
•
Extremely Fast Switching Speed
Extremely Low Forward Voltage 0.5 V (max) @ I
F
= 200 mA
Low Reverse Current
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current DC
Peak Forward Surge Current (Note 1)
Symbol
V
R
I
F
I
FSM
Value
30
200
1.0
Unit
Vdc
mA
A
30 V SCHOTTKY
BARRIER DIODE
SOD−523
CASE 502
1
CATHODE
2
ANODE
MARKING DIAGRAM
5M MG
G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. 60 Hz for 1 cycle.
1
5M
M
G
2
= Device Code
= Date Code*
= Pb−Free Package
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 2)
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
Range
2. FR−5 Minimum Pad.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Symbol
P
D
200
1.57
R
qJA
T
J
, T
stg
635
−55
to +125
mW
mW/°C
°C/W
°C
Max
Unit
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
ORDERING INFORMATION
Device
RB521S30T1G
Package
Shipping
†
SOD−523 3000/Tape & Reel
(Pb−Free)
NSVRB521S30T1G SOD−523 3000/Tape & Reel
(Pb−Free)
RB521S30T5G
SOD−523 8000/Tape & Reel
(Pb−Free)
NSVRB521S30T5G SOD−523 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2015
September, 2018
−
Rev. 11
1
Publication Order Number:
RB521S30T1/D
RB521S30
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
−Y−
E
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
b
0.08
1
M
2
X Y
TOP VIEW
A
c
H
E
SIDE VIEW
2X
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
L
RECOMMENDED
SOLDERING FOOTPRINT*
0.48
2X
1.80
0.40
2X
2X
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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For additional information, please contact your local
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3
RB521S30T1/D
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