Formosa MS
FM220-MHT THRU FM2200-MHT
Chip Schottky Barrier Rectifier
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/08/10
Revised Date
2011/10/12
Revision
B
Page.
7
Page 1
DS-12163Z
Formosa MS
FM220-MHT THRU FM2200-MHT
Chip Schottky Barrier Rectifier
2.0A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Features
•
Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Tiny plastic SMD package.
Low power loss, high efficiency.
High current capability, low forward voltage drop.
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free part, ex.FM220-MHT-H.
Package outline
SOD-123HT
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.055(1.4)
0.039(1.0)
0.024(0.6)
0.004(0.10)Typ.
0.083(2.1)
0.075(1.9)
0.031(0.8) Typ.
Mechanical data
•
Epoxy : UL94-V0 rated flame retardant
•
Case : Molded plastic, SOD-123HT
•
Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
0.024(0.6)Typ.
0.051(1.3)
0.043(1.1)
0.032(0.8)
0.028(0.6)
0.047(1.2)
0.039(1.0)
0.0335(0.85)
0.0296(0.75)
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 0.011 gram
0.047(1.2)
0.039(1.0)
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics
(AT
PARAMETER
Forward rectified current
Forward surge current
See Fig.1
CONDITIONS
T
A
=25
o
C unless otherwise noted)
Symbol
I
O
I
FSM
I
R
R
θJA
R
θJC
C
J
T
STG
-65
72
36
160
+175
MIN.
TYP.
MAX.
2.0
50
0.2
10
O
O
UNIT
A
A
8.3ms single half sine-wave (JEDEC methode)
V
R
= V
RRM
T
J
= 25
O
C
V
R
= V
RRM
T
J
= 100 C
Junction to ambient
Junction to case
f=1MHz and applied 4V DC reverse voltage
O
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
*1
V
RRM
(V)
20
30
40
50
60
80
100
150
200
V
RMS
*2
(V)
14
21
28
35
42
56
70
105
140
mA
C/W
C/W
pF
O
C
SYMBOLS
FM220-MHT
FM230-MHT
FM240-MHT
FM250-MHT
FM260-MHT
FM280-MHT
FM2100-MHT
FM2150-MHT
FM2200-MHT
*3
V
R
(V)
20
30
40
50
60
80
100
150
200
*4
V
F
(V)
Operating
temperature
T
J
, (
O
C)
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
0.50
0.70
0.85
0.90
0.92
-55 to +150
*3 Continuous reverse voltage
*4 Maximum forward voltage@I
F
=2.0A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/08/10
Revised Date
2011/10/12
Revision
B
Page.
7
Page 2
DS-12163Z
Rating and characteristic curves (FM220-MHT THRU FM2200-MHT)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
FIG.2-TYPICAL FORWARD
CHARACTERISTICS
2.4
2.0
25
FM
50
INSTANTANEOUS FORWARD CURRENT,(A)
20V ~ 40V
FM
1.6
~
HT
0-M
22
~
HT
0-M
1.2
0.8
0.4
0
0
20
40
60
80
10
3.0
1.0
50V ~ 60V
22
FM
FM
0-M
24
HT
80V ~ 100V
150V~200V
00
HT
-M
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
50
0.1
T
J
=25 C
Pulse Width 300us
1% Duty Cycle
PEAK FORWARD SURGE CURRENT,(A)
40
.01
.1
.3
.5
.7
.9
1.1
1.3
1.5
30
T
J
=25 C
8.3ms Single Half
Sine Wave
JEDEC method
FORWARD VOLTAGE,(V)
20
10
FIG.5 - TYPICAL REVERSE
0
1
5
10
50
100
100
CHARACTERISTICS
20V~40V
50V~200V
NUMBER OF CYCLES AT 60Hz
10
FIG.4-TYPICAL JUNCTION CAPACITANCE
700
600
500
400
300
200
100
0
REVERSE LEAKAGE CURRENT, (mA)
JUNCTION CAPACITANCE,(pF)
1.0
T
J
=100°C
0.1
T
J
=25°C
0.01
.01
.05
.1
.5
1
5
10
50
100
0.001
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/08/10
Revised Date
2011/10/12
Revision
B
Page.
7
Page 3
DS-12163Z
Formosa MS
FM220-MHT THRU FM2200-MHT
Chip Schottky Barrier Rectifier
Pinning information
Pin
Pin1
Pin2
cathode
anode
Simplified outline
Symbol
1
2
1
2
Marking
Type number
FM220-MHT
FM230-MHT
FM240-MHT
FM250-MHT
FM260-MHT
FM280-MHT
FM2100-MHT
FM2150-MHT
FM2200-MHT
Suggested solder pad layout
Marking code
22
23
24
25
26
28
20
215
220
SOD-123HT
0.036 (0.90)
0.044 (1.10)
0.048 (1.20)
0.075 (1.90)
0.036 (0.90)
0.028 (0.70)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/08/10
Revised Date
2011/10/12
Revision
B
Page.
7
Page 4
DS-12163Z
Formosa MS
FM220-MHT THRU FM2200-MHT
Chip Schottky Barrier Rectifier
Packing information
P
0
P
1
d
E
F
B
W
A
P
D
2
T
C
D
W
1
D
1
unit:mm
Item
Symbol
Tolerance
SOD-123HT
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
-
-
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/08/10
Revised Date
2011/10/12
Revision
B
Page.
7
Page 5
DS-12163Z
聊聊、笑笑、闹闹
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
