Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Micron Technology |
零件包装代码 | TSOP |
包装说明 | TSSOP, TSSOP48,.8,20 |
针数 | 48 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.1.A |
最长访问时间 | 70 ns |
其他特性 | TOP BOOT BLOCK |
备用内存宽度 | 8 |
启动块 | TOP |
命令用户界面 | YES |
通用闪存接口 | YES |
数据轮询 | YES |
JESD-30 代码 | R-PDSO-G48 |
JESD-609代码 | e3 |
长度 | 18.4 mm |
内存密度 | 33554432 bit |
内存集成电路类型 | FLASH |
内存宽度 | 16 |
功能数量 | 1 |
部门数/规模 | 8,63 |
端子数量 | 48 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 2MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP48,.8,20 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3/3.3 V |
编程电压 | 3 V |
认证状态 | Not Qualified |
就绪/忙碌 | YES |
座面最大高度 | 1.2 mm |
部门规模 | 8K,64K |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.02 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
切换位 | YES |
类型 | NOR TYPE |
宽度 | 12 mm |
M29W320ET70N6E | M29W320EB70N6E | M29W320ET70ZE6E | M29W320EB70N6 | M29W320EB70ZE6E | M29W320ET70ZS6E | M29W320EB70ZS6E | |
---|---|---|---|---|---|---|---|
描述 | Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 | Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 | Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 | Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 | Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 | Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64 | Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64 |
是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
包装说明 | TSSOP, TSSOP48,.8,20 | TSSOP, TSSOP48,.8,20 | TFBGA, BGA48,6X8,32 | 12 X 20 MM, PLASTIC, TSOP-48 | TFBGA, BGA48,6X8,32 | LBGA, BGA64,8X8,32 | LBGA, BGA64,8X8,40 |
Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | unknown | unknow |
最长访问时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
启动块 | TOP | BOTTOM | TOP | BOTTOM | BOTTOM | TOP | BOTTOM |
命令用户界面 | YES | YES | YES | YES | YES | YES | YES |
通用闪存接口 | YES | YES | YES | YES | YES | YES | YES |
数据轮询 | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PBGA-B48 | R-PDSO-G48 | R-PBGA-B48 | R-PBGA-B64 | R-PBGA-B64 |
长度 | 18.4 mm | 18.4 mm | 8 mm | 18.4 mm | 8 mm | 13 mm | 13 mm |
内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bi |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
部门数/规模 | 8,63 | 8,63 | 8,63 | 8,63 | 8,63 | 8,63 | 8,63 |
端子数量 | 48 | 48 | 48 | 48 | 48 | 64 | 64 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TFBGA | TSSOP | TFBGA | LBGA | LBGA |
封装等效代码 | TSSOP48,.8,20 | TSSOP48,.8,20 | BGA48,6X8,32 | TSSOP48,.8,20 | BGA48,6X8,32 | BGA64,8X8,32 | BGA64,8X8,40 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | 260 | 235 | 260 | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
就绪/忙碌 | YES | YES | YES | YES | YES | YES | YES |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.4 mm | 1.4 mm |
部门规模 | 8K,64K | 8K,64K | 8K,64K | 8K,64K | 8K,64K | 8K,64K | 8K,64K |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | BALL | GULL WING | BALL | BALL | BALL |
端子节距 | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 1 mm | 1 mm |
端子位置 | DUAL | DUAL | BOTTOM | DUAL | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED |
切换位 | YES | YES | YES | YES | YES | YES | YES |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 12 mm | 12 mm | 6 mm | 12 mm | 6 mm | 11 mm | 11 mm |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | - | - |
零件包装代码 | TSOP | TSOP | BGA | TSOP | BGA | - | - |
针数 | 48 | 48 | 48 | 48 | 48 | - | - |
ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | - | - |
其他特性 | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | BOTTOM BOOT BLOCK | - | - |
JESD-609代码 | e3 | e4 | e1 | e0 | e1 | - | - |
端子面层 | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | TIN LEAD | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - |
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