Features
NT
S
CO
M
PL
Applications
Used as a secondary overcurrent protection
device in:
■
Customer Premise Equipment (CPE)
■
Central Office (CO)
■
Access equipment
■
■
■
■
Two resistance-matched PTCs in a
ceramic housing
Aids compliance with:
- ITU-T K.20/21/45
- Telcordia GR-1089-CORE
- UL 60950, 3rd Ed.
Narrow resistance tolerance
RoHS compliant*
*R
oH
IA
CMF-SD Series - Telecom CPTC Resettable Fuses
Electrical Characteristics
Induction
Voltage
Withstand
VAC
Rated
Resistance
(RN)
Ohms
Tolerance
Resistance
Matching
In Housing
Ohms
Time to Trip
@ Imax/
230 VAC
Seconds
Model
Rated
Voltage
Volts
Hold
Current
Trip
Current
Imax @
230 VAC
Amps
Amps @ 25 °C Amps @ 25 °C
CMF-SD25
CMF-SD25-10
CMF-SD35
CMF-SD35-10
CMF-SD35A
CMF-SD35A-10
CMF-SD50
CMF-SD50-10
CMF-SD50A
CMF-SD50A-10
Product Dimensions
A
600
600
600
600
600
600
600
600
600
600
230
230
230
230
230
230
230
230
230
230
25
25
35
35
35
35
50
50
50
50
±20 %
±10 %
±20 %
±10 %
±20 %
±10 %
±20 %
±10 %
±20 %
±10 %
± 0.5
± 0.5
± 0.5
± 0.5
± 0.5
± 0.5
± 0.5
± 0.5
± 0.5
± 0.5
0.130
0.130
0.100
0.100
0.100
0.100
0.090
0.090
0.090
0.090
0.260
0.260
0.200
0.200
0.200
0.200
0.190
0.190
0.190
0.190
2.8
2.8
3
3
2.5
2.5
3
3
3
3
< 0.3
< 0.3
< 0.2
< 0.2
< 0.2
< 0.2
< 0.1
< 0.1
< 0.1
< 0.1
Recommended Pad Layout
CMF-SD25
CMF-SD35
CMF-SD50
9.00
MAX.
(.354)
10.80
MAX.
(.425)
10.20
MAX.
(.402)
4.88 - 5.28
(.192 - .208)
2.41 - 2.61
(.095 - .103)
0.5
MAX.
(.020)
2.5
(.098)
1.0
(.039)
B
Dim.
A
B
C
F
G
E
CMFSD35A
CMF-SD50A
7.15
MAX.
(.281)
8.50
MAX.
(.335)
8.10
MAX.
(.319)
3.25 - 3.65
(.128 - .144)
2.41 - 2.61
(.095 - .103)
1
2
A
3
F
4
D
E
G
B
H
D
E
C
C
H
DIMENSIONS =
MM
(INCHES)
D
1
Packaging options:
TAPE & REEL: CMF-SD25, CMF-SD35 & CMF-SD50
= 400 pcs. per reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
F
G
H
0.5
MAX.
(.020)
2.5
(.098)
1.0
(.039)
3
2
4
Typical Part Marking
Represents total content. Layout may vary.
PART
IDENTIFICATION:
25 = CMF-SD25
35 = CMF-SD35
50 = CMF-SD50
35A = CMF-SD35A
50A = CMF-SD50A
25K = CMF-SD25-10
35K = CMF-SD35-10
50K = CMF-SD50-10
35AK = CMF-SD35A-10
50AK = CMF-SD50A-10
MANUFACTURER'S
TRADEMARK
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
YEAR CODE:
6 = 2006
How to Order
CMF-SD25/
CMF-SD35/
Dim. CMF-SD50
A
B
C
D
E
F
G
10.0
(.394)
8.80
(.346)
3.20
(.126)
2.00
(.079)
2.60
(.102)
5.00
(.197)
7.60
(.299)
10.0
(.394)
CMF-SD35A/
CMF-SD50A
8.00
(.315)
7.05
(.278)
2.75
(.108)
2.00
(.079)
2.51
(.099)
3.45
(.136)
5.95
(.234)
8.15
(.321)
CMF - SD 35 A -10 - 2
Product Designator
Style
SD = Surface Mount Dual Pkg.
Rated Resistance (RN)
25, 35, 50 (25, 35, 50 Ohms)
Reduced Footprint and Height Option
Resistance Tolerance Option
Blank = Standard (20 %)
-10 = 10 %
Packaging Options
- 2 = Tape & Reel
356G
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
H
CMF-SD Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
250
200
150
100
50
0
160–220
10–20
Time (seconds)
120
Preheating
Soldering
Cooling
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance requirements.
Rework
• A device should not be reworked.
Temperature (°C)
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
CMF-SD SERIES, REV. G, 09/07
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CMF-SD Series Tape and Reel Specifications
CMF-SD25-2
CMF-SD35-2
CMF-SD50-2
24.0 +0.30/-0.10
(0.945 +0.012/-0.004 )
4.00 ± 0.10
(0.157 ± 0.004)
16.0 ± 0.10
(0.630 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
10.2 ± 0.10
(0.402 ± 0.004)
9.0 ± 0.10
(0.354 ± 0.004)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
11.5 ± 0.10
(0.453 + 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
0.50
(0.020)
11.0 ± 0.10
(0.433 ± 0.004)
Tape Dimensions per EIA 481-2
W
P0
P1
P2
A0
B0
D0
F
E1
T max.1
K0
D
P2
P0
CMF-SD35A-2
CMF-SD50A-2
16.0 ± 0.10
(0.630 ± 0.004 )
4.00 ± 0.10
(0.157 ± 0.004)
12.0 ± 0.10
(0.472 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
8.35 ± 0.10
(0.329 ± 0.004)
8.30 ± 0.10
(0.327 ± 0.004)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
7.5 ± 0.10
(0.295 + 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
0.50
(0.020)
8.80 ± 0.10
(0.346 ± 0.004)
E
T
CMF-SD25-2
CMF-SD35-2
CMF-SD50-2
F
W
330 -2/+0
(12.99 -.079/+0)
DIA.
B0
P
A0
5°
K0
16.4 +2.0/-0
(.646 +.079/-0)
MAX.
22.4
(.882)
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
DIA.
(3.94 ± .059)
CMF-SD35A-2
CMF-SD50A-2
D
P2
P0
E
0.50
(.020)
D1
F
W
B0
330 -2/+0
(12.99 -.079/+0)
DIA.
P
20 °
8°
A0
K1
K0
9.1
(.358)
16.4 +2.0/-0
(.646 +.079/-0)
MAX.
22.4
(.882)
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
UNIT =
MM
(INCHES)
4.5
(.177)
A0
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
FPGA/CPLD
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