Fast Page DRAM, 1MX1, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20
| 参数名称 | 属性值 |
| 厂商名称 | OKI |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 代码 | R-PDSO-J20 |
| 长度 | 17.15 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | FAST PAGE DRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 20 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX1 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 座面最大高度 | 3.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| MSM511000H-60JS | MSM511000H-45ZS | MSM511000H-60RS | MSM511000H-50RS | MSM511000H-45JS | MSM511000H-50JS | MSM511000H-60ZS | MSM511000H-50ZS | MSM511000H-45RS | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM, 1MX1, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX1, 45ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Fast Page DRAM, 1MX1, 60ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Fast Page DRAM, 1MX1, 50ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Fast Page DRAM, 1MX1, 45ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX1, 50ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX1, 60ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Fast Page DRAM, 1MX1, 50ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Fast Page DRAM, 1MX1, 45ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 |
| 厂商名称 | OKI | OKI | OKI | OKI | OKI | OKI | OKI | OKI | OKI |
| 零件包装代码 | SOJ | ZIP | DIP | DIP | SOJ | SOJ | ZIP | ZIP | DIP |
| 包装说明 | SOJ, | ZIP, | DIP, | DIP, | SOJ, | SOJ, | ZIP, | ZIP, | DIP, |
| 针数 | 20 | 20 | 18 | 18 | 20 | 20 | 20 | 20 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 60 ns | 45 ns | 60 ns | 50 ns | 45 ns | 50 ns | 60 ns | 50 ns | 45 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 代码 | R-PDSO-J20 | R-PZIP-T19 | R-PDIP-T18 | R-PDIP-T18 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T19 | R-PZIP-T19 | R-PDIP-T18 |
| 长度 | 17.15 mm | 25.5 mm | 22.6 mm | 22.6 mm | 17.15 mm | 17.15 mm | 25.5 mm | 25.5 mm | 22.6 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 19 | 18 | 18 | 20 | 20 | 19 | 19 | 18 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | ZIP | DIP | DIP | SOJ | SOJ | ZIP | ZIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 座面最大高度 | 3.65 mm | 10.16 mm | 5.08 mm | 5.08 mm | 3.65 mm | 3.65 mm | 10.16 mm | 10.16 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | ZIG-ZAG | DUAL |
| 宽度 | 7.62 mm | 2.8 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 2.8 mm | 2.8 mm | 7.62 mm |
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