MIPAQ™ – More Than you expect!
Infineon’s functional IGBT module family
[
www.infineon.com/mipaq
]
MIPAQ™ family
Applications
The MIPAQ™ modules
enable highly efficient
power inverter designs
to be used in
Industrial drives,
such as compressors,
pumps and fans
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uninterruptible Power
Supply (uPS)
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Air conditioning
systems
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Solar inverters
The modules are cha-
racterized by enhanced
testing and are delivered
as known-good systems.
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MIPAQ™ IS A neW funCTIOnAl product family and dedicated to useful inte-
gration of electronics into power modules.
The MIPAQ™ fAMIly was developed in order to offer Modules Integrating
Power, Application and Quality. It is a functional product family within Infineon‘s
IGBT modules portfolio. The combination of an IGBT module and the integration
of sensing and driving electronics leads to an optimized solution in mastering
the challenge of designing powerful and compact inverters for low and medium
power at low costs, contributing to energy savings to improve profitability and
protect our environment at the same time.
The MIPAQ™ fAMIly includes three products and offers significant board
space savings.
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MIPAQ™ base
MIPAQ™ sense
MIPAQ™ serve
The MIPAQ™ BASe MOdule integrates shunts, while the MIPAQ™ sense
module offers an additional current measurement feature that is fully digital with
galvanically isolated output signals, and the MIPAQ™ serve module includes
driver electronics.
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Integration Level
MIPAQ™ base
MIPAQ™ sense
MIPAQ™ serve
Chip technology
The MIPAQ™ fAMIly is based on an innovative packaging concept and utilizes
the advantages of the Infineon IGBT
4
chip technology. This technology makes it
possible to increase the power density of IGBT modules. IGBT
4
does not only pro-
vide approximately 20% lower switching losses than IGBT
3
but also significantly
higher power cycling capability.
The operation junction temperature of IGBT
4
is 150°C offering even more output
power and higher reliability for a variety of applications.
Solder and PressFIT Mounting Technology
The MIPAQ™ BASe is available with the well known solder terminals while the
MIPAQ™ sense features PressfIT connections as state-of-the-art. The advantage
of the PressfIT process is, that it can be separated from the soldering process
and allows module mounting on soldering and component side of the PCB. This
increases the design flexibility. The high reliability of PressfIT contacts in gene-
ral increases the system reliability. This is especially of interest, if modules are
operating in harsh environments.
Power Range
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The Module with Integrated Shunts
Key Benefits
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Compact modules with
a height of only 17mm
allowing low-inductive
system design
Well-proven econo
design
sixpack configuration
with shunts and nTC
Shunt values matched
to rated chip current
Allows accurate
current sensing
up to 150A nominal
current
Saves space and
system cost
150°C operation
junction temperature
excellent power
cycling capability
high power density
for compact inverter
designs
RohS compliant
One Of The fIRST family members is the MIPAQ™ base module featuring IGBT4.
MIPAQ™ base provides an IGBT sixpack plus current sense shunts inside. Owing to
the integration of specially designed shunts, the performance with regard to system
cost is excellent. MIPAQ™ base modules in sixpack configuration with nTC are availa-
ble in the well-proven econoPACK™ 3 housing with 75A, 100A and even 150A nominal
current and 1200V blocking voltage. MIPAQ™ base shunt modules save space, help to
manage the temperature on the PCB while allowing very high measurement accuracy.
Integrating Shunts in a Power Module
The ClASSICAl MeThOd to measure currents is using shunts. The voltage drop
across the shunt, caused by the current to be determined, is measured. This solution
has a known disadvantage as the resistor causes additional losses. Integrating current
sensors into industrial drives usually is done by mounting the sensor to PCB. The ther-
mal situation gets difficult, if currents in a range of up to hundred amperes occur. due
to the losses caused by the shunt in addition to heat coming from power electronic
devices and from the PCB, temperatures beyond the level tolerable for PCB materials
could be reached. Thus it is mandatory to place shunts in an area where the power
losses can be dissipated easily. Including the shunts into a power module is leading
to excellent thermal properties. despite the temperature swing coming from the losses,
the shunts in the MIPAQ™ base provide a linear relation between measured voltage
and measured current across the whole range of current and temperature.
MIPAQ™ base
Circuit Diagram
MIPAQ™ base
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Product Overview
Type
V
CeS
V
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C
A
V
Cesat
V
T
vj
=25°C typ.
1,85
1,75
1,75
P
tot
W
385
515
750
R
thjC
K/W
max.
0,39
0,29
0,20
R
shunt
mΩ
T
vj
=25°C
typ.
2,40
1,50
1,00
4
IfS75B12n3T4_B31
1200
75
IfS100B12n3T4_B31 1200 100
IfS150B12n3T4_B31 1200 150
…_B31: Pin for solder connection
Key Benefits
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Compact modules with
a height of only 17mm
allowing low-inductive
system design
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Well-proven
econoPACK™ 3 packa-
ge plus current mea-
surement electronics
inside
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up to 100A nominal
current
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The Module with digital Current Measurement
In AddITIOn TO The MIPAQ™ BASe with IGBT sixpack configuration and
three highly sophisticated current shunts, the MIPAQ™ sense module also
integrates a fully digital current measurement with galvanically isolated output
signals using the Sigma delta measurement method. With Infineon‘s Coreless
Transformer Technology (ClT), optocouplers are no longer required, saving addi-
tional board space. The measurement integrated in the MIPAQ™sense provides
accurate data for regulation purpose as well as information to handle over
current situations. The MIPAQ™ sense modules manage currents of 75 A and
100 A. They are available in econoPACK™ 3 housing using PressfIT interconnec-
tion technology for fast, reliable and solder-less mounting.
MIPAQ™ sense Functional Diagram
MIPAQ™ sense
highly sophisticated
new current shunt
included
Sigma delta method
for current measure-
ment inside
Galvanically insulated
current measurement
signal by using Infineon
Coreless Transformer
Technology (ClT), i. e.
no need for optocoupler
excellent accuracy and
temperature stability
Possibility to use cur-
rent measurement with
either high accuracy or
short access time deci-
ded by software
Saves board space in
the application, due to
integrated shunts and
measurement electronic
150°C operation junc-
tion temperature
excellent power
cycling capability
high power density
for compact inverter
designs
RohS compliant
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