Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28
| 参数名称 | 属性值 |
| 厂商名称 | OKI |
| 零件包装代码 | ZIP |
| 包装说明 | ZIP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PZIP-T28 |
| 长度 | 36 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | ZIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 10.16 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.27 mm |
| 端子位置 | ZIG-ZAG |
| 宽度 | 2.8 mm |
| MSM51V8222A-30ZS | MSM51V8222A-40ZS | MSM51V8222A-30GS-K | MSM51V8222A-30JS | MSM51V8222A-40GS-K | MSM51V8222A-40JS | |
|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 |
| 厂商名称 | OKI | OKI | OKI | OKI | OKI | OKI |
| 零件包装代码 | ZIP | ZIP | SOIC | SOJ | SOIC | SOJ |
| 包装说明 | ZIP, | ZIP, | SOP, | SOJ, | SOP, | SOJ, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PZIP-T28 | R-PZIP-T28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-J28 |
| 长度 | 36 mm | 36 mm | 18.5 mm | 18.41 mm | 18.5 mm | 18.41 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | ZIP | ZIP | SOP | SOJ | SOP | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 10.16 mm | 10.16 mm | 2.5 mm | 3.75 mm | 2.5 mm | 3.75 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | J BEND | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | ZIG-ZAG | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 2.8 mm | 2.8 mm | 8.8 mm | 10.16 mm | 8.8 mm | 10.16 mm |
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