Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, ZIP-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LAPIS Semiconductor Co Ltd |
零件包装代码 | ZIP |
包装说明 | ZIP, ZIP28,.1 |
针数 | 28 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PZIP-T28 |
JESD-609代码 | e0 |
长度 | 36 mm |
内存密度 | 2097152 bit |
内存集成电路类型 | MEMORY CIRCUIT |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | ZIP |
封装等效代码 | ZIP28,.1 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 10.16 mm |
最大待机电流 | 0.003 A |
最大压摆率 | 0.035 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 1.27 mm |
端子位置 | ZIG-ZAG |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 2.8 mm |
MSM51V8221A-40ZS | MSM51V8221A-30JS | MSM51V8221A-30GS-K | MSM51V8221A-40GS-K | MSM51V8221A-30ZS | MSM51V8221A-40JS | MSM51V8221A-35GS-K | |
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描述 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory IC |
厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
包装说明 | ZIP, ZIP28,.1 | SOJ, SOJ28,.44 | SOP, SOP28,.45 | SOP, SOP28,.45 | ZIP, ZIP28,.1 | SOJ, SOJ28,.44 | , |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
零件包装代码 | ZIP | SOJ | SOIC | SOIC | ZIP | SOJ | - |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | - |
JESD-30 代码 | R-PZIP-T28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PZIP-T28 | R-PDSO-J28 | - |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - |
长度 | 36 mm | 18.41 mm | 18.5 mm | 18.5 mm | 36 mm | 18.41 mm | - |
内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | - |
内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | - |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | - |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | - |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | - |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | ZIP | SOJ | SOP | SOP | ZIP | SOJ | - |
封装等效代码 | ZIP28,.1 | SOJ28,.44 | SOP28,.45 | SOP28,.45 | ZIP28,.1 | SOJ28,.44 | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 10.16 mm | 3.75 mm | 2.5 mm | 2.5 mm | 10.16 mm | 3.75 mm | - |
最大待机电流 | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | - |
最大压摆率 | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | - |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
表面贴装 | NO | YES | YES | YES | NO | YES | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | THROUGH-HOLE | J BEND | GULL WING | GULL WING | THROUGH-HOLE | J BEND | - |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
端子位置 | ZIG-ZAG | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 2.8 mm | 10.16 mm | 8.8 mm | 8.8 mm | 2.8 mm | 10.16 mm | - |
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