Memory IC, CMOS, PDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LAPIS Semiconductor Co Ltd |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
最长访问时间 | 50 ns |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.01 A |
最大压摆率 | 0.035 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
MSM514221B-60RS | MSM514221B-30RS | MSM514221B-60ZS | MSM514221B-30JS | MSM514221B-40JS | MSM514221B-40RS | MSM514221B-60JS | |
---|---|---|---|---|---|---|---|
描述 | Memory IC, CMOS, PDIP16 | Memory IC, CMOS, PDIP16 | Memory IC, CMOS, PZIP20 | Memory IC, CMOS, PDSO20 | Memory IC, CMOS, PDSO20 | Memory IC, CMOS, PDIP16 | Memory IC, CMOS, PDSO20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | DIP, DIP16,.3 | SOJ, SOJ20/26,.34 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 50 ns | 25 ns | 50 ns | 25 ns | 30 ns | 30 ns | 50 ns |
JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PZIP-T20 | R-PDSO-J20 | R-PDSO-J20 | R-PDIP-T16 | R-PDSO-J20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 16 | 16 | 20 | 20 | 20 | 16 | 20 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | ZIP | SOJ | SOJ | DIP | SOJ |
封装等效代码 | DIP16,.3 | DIP16,.3 | ZIP20,.1 | SOJ20/26,.34 | SOJ20/26,.34 | DIP16,.3 | SOJ20/26,.34 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
最大压摆率 | 0.035 mA | 0.05 mA | 0.035 mA | 0.05 mA | 0.045 mA | 0.045 mA | 0.035 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL |
厂商名称 | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
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