FUJITSU SEMICONDUCTOR
DATA SHEET
DS07-20101-7E
Resonator
Piezoelectric Resonator
FAR Family (C1, C3, C4 series)
s
DESCRIPTION
Fujitsu resonators (C1, C3, C4 series) feature originally developed single crystals with a high electromechanical
coupling coefficient (LiTaO
3
: lithium tantalate, LiNbO
3
: lithium niobate), the result is compact packaging. Three
series are available: the C3 and C4 series with built-in capacitors for high integration, for exclusive use in
microcomputer clocks; and the C1 series for high precision. All series include the CHIP type device for surface-
mount and the SIP type device for general PC boards.
s
FEATURES
•
•
•
•
Surface-mount technology can be applied to the CHIP type to increase packaging density. The SIP type is
only half the height of conventional quartz crystal resonators, and can be easily mounted on general PC boards.
The C3 and C4 series have been developed for exclusive use in microcomputer clocks. They have built-in
capacitors, and the number of components has been reduced to one-third of that of conventional circuits.
Both the SIP and CHIP types can be shipped in taped packages for automatic mounting.
The resonators have superior shock and vibration resistance, preventing damage during automatic insertion
process.
s
PACKAGE
FAR Family (C1, C3, C4 series)
s
STANDARD CHARACTERISTICS
Series
Parameter
Material
Frequency
Standard frequency
Initial frequency
tolerance
Temperature
characteristics
(–20 to 60°C)
Capacity of built-in
capacitor
Aging stability
Operating temperature
Storage temperature
(Resonant frequency and serial
resonant resistance)
R:
Resonator
C1 series
C3 series
C4 series
Lithium Niobate (LiNbO
3
)
3 to 16 MHz
Lithium Tantalate (LiTaO
3
)
3.58 to 16 MHz
See “s Standard frequency.”
±0.05% (G)
±0.1% (J)
±0.3% (K)
±0.5% (M)
±0.02%
—
±0.1% (J)
±0.3% (K)
±0.5% (M)
±0.05%
±0.5% (M)
±0.3% (K)
±1% (L)
±0.5%
20±8 pF (standard)*
Within ±0.1%
–30 to 85°C
–40 to 100°C
(Oscillation frequency)
1 M
Ω
R
3 MHz to 10 MHz max.
IC; 1/6MB84069B x 2
10 MHz to 16 MHz
IC; MC74HC04
V
CC
; 5 VDC
R; Resonator
C1, C2: Loading capacitors
(built-in)
FAR
(Serial resonant resistance)
R
75
Ω
OSC
C
1
C
2
R: Resonator
30 pF
R
75
Ω
OSC
75
Ω
C
1
C
2
LM
Standard measuring
circuit
75
Ω
LM
*: The capacity of the built-in capacitor is 20±8 pF by standard.
10±4 pF and 30±8 pF types are also available. However, the characteristics of 10±4 pF and 30±8 pF types are specified by
Fujitsu, considering matching data with applied IC (mainly microcomputer).
2
FAR Family (C1, C3, C4 series)
s
STANDARD FREQUENCY
Standard
frequency (kHz)
3,580
4,000
4,194
4,915
6,000
6,144
7,373
8,000
10,000
11,000
11,059
12,000
14,746
16.000
•
C1/C3 series
Package
size
A
A
A
A
B
B
B
B
B
B
B
B
B
B
Resonant
resistance
300
Ω
max.
(00)
Package
size
A
A
A
A
B
B
B
B
B
B
B
B
B
B
C4 series
Resonant
resistance
150
Ω
max.
(01)
150
Ω
max.
(01)
75
Ω
max.
(02)
Package sizes and resonant resistance
There are two package sizes according to frequency:
Frequency
3 to 5.99 MHz
6 to 16 MHz
Package size
A
B
For resonant resistance, standard values are specified according to frequency:
Frequency
3 to 3.57 MHz
3.58 to 5.99 MHz
6 to 16 MHz
Standard resonant resistance
C1/C3 series
—
300
Ω
max.
(00)
150
Ω
max.
(01)
C4 series
300
Ω
max.
(00)
150
Ω
max.
(01)
75
Ω
max.
(02)
Note:
For resonant resistance other than the standard values, they are specified by Fujitsu considering matching data with
applied IC (mainly micro computer).
s
NOTES ON USE
•
•
Handle carefully.
Solder under the following conditions.
CHIP type: 5 seconds max. at 230°C (PCB)
SIP type: 10 seconds max. at 260°C
Do not apply extreme heat to the resonator. Recommended preheating for the CHIP type is 150°C for one
minute.
Avoid extreme fluctuations in temperature during use.
There is no specific direction in resonator mounting.
Additional information is available separately, if required, for designing microcomputer oscillation circuits.
CHIP type is for reflow solder, not for flow solder.
3
•
•
•
•
FAR Family (C1, C3, C4 series)
s
PART NUMBERING SYSTEM
FAR
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(1) Series
Series
C1
C3
C4
Single crystal
LiTaO
3
LiTaO
3
LiNbO
3
Capacitor
—
With built-in capacitors
With built-in capacitors
(2) Package type
Specification
C
S
Type
CHIP
SIP
(3) Package size
See Table 1 in “s Dimensions.”
Specification
A
B
Size
Large
Small
(4) Frequency (kHz)
Frequency Designation Frequency Designation Frequency Designation Frequency Designation
3,580 kHz
4,000 kHz
4,194 kHz
4,195 kHz
03580
04000
04194
04915
6,000 kHz
6,144 kHz
7,373 kHz
8,000 kHz
06000
06144
07373
08000
10,000 kHz
11,000 kHz
11,059 kHz
12,000 kHz
10000
11000
11059
12000
14,746 kHz
16,000 kHz
14746
16000
(5) Initial tolerance of frequency
See “s Standard Frequency.”
Specification
G
J
K
M
L
4
Tolerance
±0.05%
±0.1%
±0.3%
±0.5%
±1%
C1 series
available
available
available
avaialble
—
C3 series
—
available
available
available
—
C4 series
—
—
available
available
available
FAR Family (C1, C3, C4 series)
(6) Capacity of built-in capacitor
Specification
0
1
2
Note:
For C1 series, only “0” is available.
Capacitance
20±8 pF
10±4 pF
30±8 pF
(7) Resonant resistance
Specification
0
1
2
Resonant resistance
300
Ω
max.
150
Ω
max.
75
Ω
max.
(8) User-specific Special Symbols
Specification
Name
—
A to Z
Description
No specification, no taping specification
No specification, with taping specification
Serial number for custom design
(9)Taping specification
• SIP type
Specification
–T
–U
Description
Reel pack
Ammo pack
• CHIP type
Specification
–R
Description
16 mm carrier pack
5
FPGA/CPLD
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