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74AHC240BQ

产品描述Octal buffer/line driver; inverting; 3-state
产品类别逻辑    逻辑   
文件大小114KB,共16页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AHC240BQ概述

Octal buffer/line driver; inverting; 3-state

74AHC240BQ规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码QFN
包装说明2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
针数20
Reach Compliance Codecompli
控制类型ENABLE LOW
系列AHC/VHC/H/U/V
JESD-30 代码R-PQCC-N20
长度4.5 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.008 A
湿度敏感等级1
位数8
功能数量1
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性INVERTED
封装主体材料PLASTIC/EPOXY
封装代码HVQCCN
封装等效代码LCC20,.1X.18,20
封装形状RECTANGULAR
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)260
电源2/5.5 V
Prop。Delay @ Nom-Su10.6 ns
传播延迟(tpd)15.6 ns
认证状态Not Qualified
座面最大高度1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度2.5 mm

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74AHC240; 74AHCT240
Octal buffer/line driver; inverting; 3-state
Rev. 2 — 26 November 2010
Product data sheet
1. General description
The 74AHC240 and 74AHCT240 are 8-bit inverting buffer/line drivers with 3-state outputs.
These devices can be used as two 4-bit buffers or one 8-bit buffer. They feature two
output enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on
nOE causes the outputs to assume a high-impedance OFF-state. Inputs are over voltage
tolerant. This feature allows the use of these devices as translators in mixed voltage
environments.
2. Features and benefits
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than V
CC
For 74AHC240 only: operates with CMOS input levels
For 74AHCT240 only: operates with TTL input levels
ESD protection:
HBM JESD22-A114F exceeds 2000 V
CDM JESD22-C101D exceeds 1000 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC240D
74AHCT240D
74AHC240PW
74AHCT240PW
74AHC240BQ
74AHCT240BQ
40 C
to +125
C
DHVQFN20
40 C
to +125
C
TSSOP20
40 C
to +125
C
Name
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT360-1
Type number
plastic dual in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
4.5
0.85 mm

74AHC240BQ相似产品对比

74AHC240BQ 74AHC240 74AHC240PW 74AHCT240D 74AHCT240PW 74AHCT240BQ
描述 Octal buffer/line driver; inverting; 3-state Octal buffer/line driver; inverting; 3-state Octal buffer/line driver; inverting; 3-state Octal buffer/line driver; inverting; 3-state Octal buffer/line driver; inverting; 3-state Octal buffer/line driver; inverting; 3-state
是否Rohs认证 符合 - 符合 符合 符合 符合
厂商名称 NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 QFN - TSSOP SOIC TSSOP QFN
包装说明 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 - TSSOP, TSSOP20,.25 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
针数 20 - 20 20 20 20
Reach Compliance Code compli - compli compli compli compli
控制类型 ENABLE LOW - ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
系列 AHC/VHC/H/U/V - AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHCT/VHCT/VT
JESD-30 代码 R-PQCC-N20 - R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20
长度 4.5 mm - 6.5 mm 12.8 mm 6.5 mm 4.5 mm
负载电容(CL) 50 pF - 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER - BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.008 A - 0.008 A 0.008 A 0.008 A 0.008 A
湿度敏感等级 1 - 1 1 1 1
位数 8 - 8 8 8 8
功能数量 1 - 1 1 1 1
端口数量 2 - 2 2 2 2
端子数量 20 - 20 20 20 20
最高工作温度 125 °C - 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 INVERTED - INVERTED INVERTED INVERTED INVERTED
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVQCCN - TSSOP SOP TSSOP HVQCCN
封装等效代码 LCC20,.1X.18,20 - TSSOP20,.25 SOP20,.4 TSSOP20,.25 LCC20,.1X.18,20
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) 260 - 260 260 260 260
电源 2/5.5 V - 2/5.5 V 5 V 5 V 5 V
Prop。Delay @ Nom-Su 10.6 ns - 10.6 ns 11.9 ns 11.9 ns 11.9 ns
传播延迟(tpd) 15.6 ns - 15.6 ns 11.9 ns 11.9 ns 11.9 ns
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm - 1.1 mm 2.65 mm 1.1 mm 1 mm
最大供电电压 (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V - 2 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V - 5 V 5 V 5 V 5 V
表面贴装 YES - YES YES YES YES
技术 CMOS - CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 NO LEAD - GULL WING GULL WING GULL WING NO LEAD
端子节距 0.5 mm - 0.65 mm 1.27 mm 0.65 mm 0.5 mm
端子位置 QUAD - DUAL DUAL DUAL QUAD
处于峰值回流温度下的最长时间 30 - 30 30 30 30
宽度 2.5 mm - 4.4 mm 7.5 mm 4.4 mm 2.5 mm

 
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