16-bit Proprietary Microcontroller
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | FUJITSU(富士通) |
零件包装代码 | QFP |
包装说明 | LFQFP, QFP80,.55SQ,20 |
针数 | 80 |
Reach Compliance Code | compliant |
ECCN代码 | 3A001.A.3 |
具有ADC | YES |
地址总线宽度 | 24 |
位大小 | 16 |
CPU系列 | F2MC-16F |
最大时钟频率 | 56 MHz |
DAC 通道 | NO |
DMA 通道 | YES |
外部数据总线宽度 | 16 |
JESD-30 代码 | S-PQFP-G80 |
JESD-609代码 | e6 |
长度 | 12 mm |
I/O 线路数量 | 64 |
端子数量 | 80 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装等效代码 | QFP80,.55SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 12288 |
ROM(单词) | 294912 |
ROM可编程性 | FLASH |
座面最大高度 | 1.7 mm |
速度 | 56 MHz |
最大压摆率 | 65 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Bismuth (Sn/Bi) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 12 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
MB96F326YWBPMC-GSE2 | MB96320 | MB96F326ASBPMC-GSE2 | MB96F326 | MB96F326AWBPMC-GSE2 | MB96F326RSBPMC-GSE2 | MB96F326RWBPMC-GSE2 | MB96F326YSBPMC-GSE2 | |
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描述 | 16-bit Proprietary Microcontroller | 16-bit Proprietary Microcontroller | 16-bit Proprietary Microcontroller | 16-bit Proprietary Microcontroller | 16-bit Proprietary Microcontroller | 16-bit Proprietary Microcontroller | 16-bit Proprietary Microcontroller | 16-bit Proprietary Microcontroller |
是否Rohs认证 | 符合 | - | 符合 | - | - | 符合 | 符合 | 符合 |
厂商名称 | FUJITSU(富士通) | - | FUJITSU(富士通) | - | - | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) |
包装说明 | LFQFP, QFP80,.55SQ,20 | - | LFQFP, QFP80,.55SQ,20 | - | - | 12 X 12 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-80 | LFQFP, QFP80,.55SQ,20 | LFQFP, QFP80,.55SQ,20 |
Reach Compliance Code | compliant | - | compli | - | - | compli | compli | compli |
ECCN代码 | 3A001.A.3 | - | 3A001.A.3 | - | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
具有ADC | YES | - | YES | - | - | YES | YES | YES |
地址总线宽度 | 24 | - | 24 | - | - | 24 | 24 | 24 |
位大小 | 16 | - | 16 | - | - | 16 | 16 | 16 |
CPU系列 | F2MC-16F | - | F2MC-16F | - | - | F2MC-16F | F2MC-16F | F2MC-16F |
最大时钟频率 | 56 MHz | - | 56 MHz | - | - | 56 MHz | 56 MHz | 56 MHz |
DAC 通道 | NO | - | NO | - | - | NO | NO | NO |
DMA 通道 | YES | - | YES | - | - | YES | YES | YES |
外部数据总线宽度 | 16 | - | 16 | - | - | 16 | 16 | 16 |
JESD-30 代码 | S-PQFP-G80 | - | S-PQFP-G80 | - | - | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 |
JESD-609代码 | e6 | - | e6 | - | - | e6 | e6 | e6 |
长度 | 12 mm | - | 12 mm | - | - | 12 mm | 12 mm | 12 mm |
I/O 线路数量 | 64 | - | 66 | - | - | 66 | 64 | 66 |
端子数量 | 80 | - | 80 | - | - | 80 | 80 | 80 |
最高工作温度 | 125 °C | - | 125 °C | - | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | - | YES | - | - | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | - | LFQFP | - | - | LFQFP | LFQFP | LFQFP |
封装等效代码 | QFP80,.55SQ,20 | - | QFP80,.55SQ,20 | - | - | QFP80,.55SQ,20 | QFP80,.55SQ,20 | QFP80,.55SQ,20 |
封装形状 | SQUARE | - | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | - | - | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 | - | 260 | - | - | 260 | 260 | 260 |
电源 | 3.3/5 V | - | 3.3/5 V | - | - | 3.3/5 V | 3.3/5 V | 3.3/5 V |
认证状态 | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 12288 | - | 12288 | - | - | 12288 | 12288 | 12288 |
ROM(单词) | 294912 | - | 294912 | - | - | 294912 | 294912 | 294912 |
ROM可编程性 | FLASH | - | FLASH | - | - | FLASH | FLASH | FLASH |
座面最大高度 | 1.7 mm | - | 1.7 mm | - | - | 1.7 mm | 1.7 mm | 1.7 mm |
速度 | 56 MHz | - | 56 MHz | - | - | 56 MHz | 56 MHz | 56 MHz |
最大压摆率 | 65 mA | - | 65 mA | - | - | 65 mA | 65 mA | 65 mA |
最大供电电压 | 5.5 V | - | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 3 V | - | 3 V | - | - | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | - | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | - | - | YES | YES | YES |
技术 | CMOS | - | CMOS | - | - | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Tin/Bismuth (Sn/Bi) | - | Tin/Bismuth (Sn/Bi) | - | - | Tin/Bismuth (Sn/Bi) | Tin/Bismuth (Sn/Bi) | Tin/Bismuth (Sn/Bi) |
端子形式 | GULL WING | - | GULL WING | - | - | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | - | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | - | QUAD | - | - | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 12 mm | - | 12 mm | - | - | 12 mm | 12 mm | 12 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | - | MICROCONTROLLER | - | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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