EDO DRAM, 1MX16, 70ns, CMOS, CDSO44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Micross |
| 包装说明 | SSOP, SOP44/50,.54,32 |
| Reach Compliance Code | compliant |
| 最长访问时间 | 70 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XDSO-G44 |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | EDO DRAM |
| 内存宽度 | 16 |
| 端子数量 | 44 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1MX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | SSOP |
| 封装等效代码 | SOP44/50,.54,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 1024 |
| 筛选级别 | 38535Q/M;38534H;883B |
| 自我刷新 | NO |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.155 mA |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| AS4LC1M16ECG7/883 | AS4LC1M16ECJ8/883 | AS4LC1M16ECJ6/883 | AS4LC1M16ECJ7/883 | AS4LC1M16ECG8/883 | AS4LC1M16EC8/883 | AS4LC1M16ECG6/883 | AS4LC1M16EC6/883 | AS4LC1M16EC7/883 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EDO DRAM, 1MX16, 70ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 80ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 60ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 70ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 80ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 80ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 60ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 60ns, CMOS, CDSO44 | EDO DRAM, 1MX16, 70ns, CMOS, CDSO44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Micross | Micross | Micross | Micross | Micross | Micross | Micross | Micross | Micross |
| 包装说明 | SSOP, SOP44/50,.54,32 | SOJ, SOJ44/50,.44 | SOJ, SOJ44/50,.44 | SOJ, SOJ44/50,.44 | SSOP, SOP44/50,.54,32 | SON, SOLCC44/50,.44,32 | SSOP, SOP44/50,.54,32 | SON, SOLCC44/50,.44,32 | SON, SOLCC44/50,.44,32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 70 ns | 80 ns | 60 ns | 70 ns | 80 ns | 80 ns | 60 ns | 60 ns | 70 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDSO-G44 | R-XDSO-J44 | R-XDSO-J44 | R-XDSO-J44 | R-XDSO-G44 | R-XDSO-N44 | R-XDSO-G44 | R-XDSO-N44 | R-XDSO-N44 |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | SSOP | SOJ | SOJ | SOJ | SSOP | SON | SSOP | SON | SON |
| 封装等效代码 | SOP44/50,.54,32 | SOJ44/50,.44 | SOJ44/50,.44 | SOJ44/50,.44 | SOP44/50,.54,32 | SOLCC44/50,.44,32 | SOP44/50,.54,32 | SOLCC44/50,.44,32 | SOLCC44/50,.44,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 自我刷新 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.155 mA | 0.14 mA | 0.17 mA | 0.155 mA | 0.14 mA | 0.14 mA | 0.17 mA | 0.17 mA | 0.155 mA |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | J BEND | J BEND | J BEND | GULL WING | NO LEAD | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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