8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | DIP |
包装说明 | PLASTIC, DIP-20 |
针数 | 20 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 2.048 V |
最小模拟输入电压 | -2.048 V |
最长转换时间 | 10 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T20 |
JESD-609代码 | e0 |
长度 | 26.16 mm |
最大线性误差 (EL) | 0.0122% |
湿度敏感等级 | 1 |
标称负供电电压 | -5 V |
模拟输入通道数量 | 8 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 240 |
采样速率 | 0.133 MHz |
采样并保持/跟踪并保持 | TRACK |
座面最大高度 | 4.572 mm |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 7.62 mm |
MAX1202ACPP | MAX1203BCPP | MAX1202AEPP | MAX1202BEPP | MAX1203BEAP | |
---|---|---|---|---|---|
描述 | 8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO20, 5.30 MM, 0.65 MM PITCH, PLASTIC, SSOP-20 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | DIP | DIP | DIP | DIP | SSOP |
包装说明 | PLASTIC, DIP-20 | PLASTIC, DIP-20 | PLASTIC, DIP-20 | PLASTIC, DIP-20 | 5.30 MM, 0.65 MM PITCH, PLASTIC, SSOP-20 |
针数 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
最大模拟输入电压 | 2.048 V | 2.048 V | 2.048 V | 2.048 V | 2.048 V |
最小模拟输入电压 | -2.048 V | -2.048 V | -2.048 V | -2.048 V | -2.048 V |
最长转换时间 | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
长度 | 26.16 mm | 26.16 mm | 26.16 mm | 26.16 mm | 7.2 mm |
最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0122% | 0.0244% | 0.0244% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
标称负供电电压 | -5 V | -5 V | -5 V | -5 V | -5 V |
模拟输入通道数量 | 8 | 8 | 8 | 8 | 8 |
位数 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C |
输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 |
采样速率 | 0.133 MHz | 0.133 MHz | 0.133 MHz | 0.133 MHz | 0.133 MHz |
采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 1.99 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 5.29 mm |
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