OT PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28
| 参数名称 | 属性值 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 其他特性 | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
| 最大时钟频率 | 50 MHz |
| JESD-30 代码 | S-PQCC-J28 |
| 长度 | 11.5316 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 端子数量 | 28 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.5316 mm |
| PALC22V10B-15JCR | 5962-8753904LA | 5962-8867004KA | Q14F6AGKKSR12A-012 | 5962-8867005KA | 5962-88670053A | 5962-88670043A | 5962-8867005LA | PALC22V10B-15JIR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | OT PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 | UV PLD, 20ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 | OT PLD, 20ns, PAL-Type, CMOS, CDFP24, CERAMIC, DFP-24 | Visible LED, | OT PLD, 15ns, PAL-Type, CMOS, CDFP24, CERAMIC, DFP-24 | OT PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 | OT PLD, 20ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 | OT PLD, 15ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 | OT PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | unknown |
| 其他特性 | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | UL RECOGNIZED | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
| 端子数量 | 28 | 24 | 24 | 2 | 24 | 28 | 28 | 24 | 28 |
| 最高工作温度 | 75 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C |
| 表面贴装 | YES | NO | YES | NO | YES | YES | YES | NO | YES |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 零件包装代码 | QLCC | DIP | DFP | - | DFP | QLCC | QLCC | DIP | QLCC |
| 包装说明 | QCCJ, | DIP, DIP24,.3 | DFP, FL24,.4 | - | DFP, FL24,.4 | CERAMIC, LCC-28 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | QCCJ, |
| 针数 | 28 | 24 | 24 | - | 24 | 28 | 28 | 24 | 28 |
| 最大时钟频率 | 50 MHz | 31.2 MHz | 31.2 MHz | - | 50 MHz | 50 MHz | 31.2 MHz | 50 MHz | 50 MHz |
| JESD-30 代码 | S-PQCC-J28 | R-GDIP-T24 | R-GDFP-F24 | - | R-GDFP-F24 | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 | S-PQCC-J28 |
| 长度 | 11.5316 mm | 31.877 mm | 15.367 mm | - | 15.367 mm | 11.43 mm | 11.43 mm | 31.877 mm | 11.5316 mm |
| 专用输入次数 | 11 | 11 | 11 | - | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | - | 10 | 10 | 10 | 10 | 10 |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | - | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DFP | - | DFP | QCCN | QCCN | DIP | QCCJ |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | - | FLATPACK | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD | UV PLD | OT PLD | - | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 15 ns | 20 ns | 20 ns | - | 15 ns | 15 ns | 20 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 5.08 mm | 2.286 mm | - | 2.286 mm | 1.9812 mm | 1.9812 mm | 5.08 mm | 4.57 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | J BEND | THROUGH-HOLE | FLAT | - | FLAT | NO LEAD | NO LEAD | THROUGH-HOLE | J BEND |
| 端子位置 | QUAD | DUAL | DUAL | - | DUAL | QUAD | QUAD | DUAL | QUAD |
| 宽度 | 11.5316 mm | 7.62 mm | 9.652 mm | - | 9.652 mm | 11.43 mm | 11.43 mm | 7.62 mm | 11.5316 mm |
| 是否Rohs认证 | - | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| ECCN代码 | - | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - |
| 架构 | - | PAL-TYPE | PAL-TYPE | - | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | - |
| JESD-609代码 | - | e0 | e0 | - | e0 | e0 | e0 | e0 | - |
| 输入次数 | - | 22 | 22 | - | 22 | 22 | 22 | 22 | - |
| 输出次数 | - | 10 | 10 | - | 10 | 10 | 10 | 10 | - |
| 产品条款数 | - | 132 | 132 | - | 132 | 132 | 132 | 132 | - |
| 封装等效代码 | - | DIP24,.3 | FL24,.4 | - | FL24,.4 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | 240 | 240 | NOT SPECIFIED | - |
| 电源 | - | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | - |
| 筛选级别 | - | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - |
| 端子面层 | - | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | - | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | - |
| Base Number Matches | - | 1 | 1 | - | 1 | 1 | 1 | 1 | - |
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