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HYS72D64020GU-7

产品描述DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184
产品类别存储    存储   
文件大小212KB,共21页
制造商Infineon(英飞凌)
官网地址http://www.infineon.com/
下载文档 详细参数 选型对比 全文预览

HYS72D64020GU-7概述

DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184

HYS72D64020GU-7规格参数

参数名称属性值
厂商名称Infineon(英飞凌)
零件包装代码DIMM
包装说明,
针数184
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式DUAL BANK PAGE BURST
最长访问时间0.75 ns
其他特性AUTO/SELF REFRESH
JESD-30 代码R-XDMA-N184
内存密度4831838208 bit
内存集成电路类型DDR DRAM MODULE
内存宽度72
功能数量1
端口数量1
端子数量184
字数67108864 words
字数代码64000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64MX72
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
自我刷新YES
最大供电电压 (Vsup)2.7 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子位置DUAL

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HYS64/72D32000GU / HYS64/72D64020GU
Unbuffered DDR-I SDRAM-Modules
2.5 V 184-pin Unbuffered DDR-I SDRAM Modules
256MB & 512MB Modules
Preliminary Datasheet Rev. 0.99
• 184-pin Unbuffered 8-Byte Dual-In-Line
DDR-I SDRAM non-parity and ECC-Modules
for PC and Server main memory applications
• One bank 32M
×
64, 32M x 72 and two bank
64M x 64, 64M
×
72 organization
• JEDEC standard Double Data Rate
Synchronous DRAMs (DDR-I SDRAM)
Single + 2.5 V (± 0.2 V) power supply
• Built with 256Mbit DDR-I SDRAMs
organisaed as 32Mb x 8 in 66-Lead TSOPII
package
• Programmable CAS Latency, Burst Length,
and Wrap Sequence (Sequential &
Interleave)
• Performance:
-7
Component Speed Grade
Module Speed Grade
f
CK
f
CK
• Auto Refresh (CBR) and Self Refresh
• All inputs and outputs SSTL_2 compatible
• Serial Presence Detect with E
2
PROM
• Jedec standard MO-206a form factor:
133.35 mm
×
31.75 mm
×
4.00 mm
• Jedec standard reference layout
• Gold plated contacts
-7.5
PC2100
133
100
-8
PC1600
125
100
Unit
DDR266A DDR266B DDR200
PC2100
143
133
MHz
MHz
Clock Frequency (max.) @ CL = 2.5
Clock Frequency (max.) @ CL = 2
The HYS64/72Dxx0x0GU are industry standard 184-pin 8-byte Dual in-line Memory Modules
(DIMMs) organized as 32M
×
64 and 64M
×
64 for non-parity and 32M x 72 and 64M x 72 for ECC
main memory applications. The memory array is designed with Double Data Rate Synchronous
DRAMs. A variety of decoupling capacitors are mounted on the PC board. The DIMMs feature serial
presence detect based on a serial E
2
PROM device using the 2-pin I
2
C protocol. The first 128 bytes
are programmed with configuration data and the second 128 bytes are available to the customer.
INFINEON Technologies
1
2.01

HYS72D64020GU-7相似产品对比

HYS72D64020GU-7 HYS64D64020GU-7.5 HYS72D32000GU-7 HYS64D32000GU-7.5 HYS72D64020GU-7.5 HYS72D64020GU-8 HYS72D32000GU-8 HYS72D32000GU-7.5
描述 DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 DDR DRAM Module, 64MX64, 0.75ns, CMOS, DIMM-184 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184 DDR DRAM Module, 32MX72, 0.8ns, CMOS, DIMM-184 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184
厂商名称 Infineon(英飞凌) Infineon(英飞凌) Infineon(英飞凌) Infineon(英飞凌) Infineon(英飞凌) Infineon(英飞凌) Infineon(英飞凌) Infineon(英飞凌)
零件包装代码 DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
针数 184 184 184 184 184 184 184 184
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 DUAL BANK PAGE BURST DUAL BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
最长访问时间 0.75 ns 0.75 ns 0.75 ns 0.75 ns 0.75 ns 0.8 ns 0.8 ns 0.75 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 代码 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184 R-XDMA-N184
内存密度 4831838208 bit 4294967296 bit 2415919104 bit 2147483648 bit 4831838208 bit 4831838208 bit 2415919104 bit 2415919104 bi
内存集成电路类型 DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
内存宽度 72 64 72 64 72 72 72 72
功能数量 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1
端子数量 184 184 184 184 184 184 184 184
字数 67108864 words 67108864 words 33554432 words 33554432 words 67108864 words 67108864 words 33554432 words 33554432 words
字数代码 64000000 64000000 32000000 32000000 64000000 64000000 32000000 32000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 64MX72 64MX64 32MX72 32MX64 64MX72 64MX72 32MX72 32MX72
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
自我刷新 YES YES YES YES YES YES YES YES
最大供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
最小供电电压 (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL

 
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