Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MD2202-D16-V3-X-P

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MD2202-D16-V3-X-P: 产品描述Flash Memory Drive, CMOS, PDIP32, ROHS COMPLIANT, DIP-32; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小324KB，共29页; 制造商SanDisk(闪迪); 标准

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MD2202-D16-V3-X-P概述

Flash Memory Drive, CMOS, PDIP32, ROHS COMPLIANT, DIP-32

MD2202-D16-V3-X-P规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	SanDisk(闪迪)
零件包装代码	DIP
包装说明	DIP,
针数	32
Reach Compliance Code	unknown
外部数据总线宽度	8
JESD-30 代码	R-PDIP-T32
端子数量	32
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
最大供电电压	3.6 V
最小供电电压	3 V
标称供电电压	3.3 V
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子形式	THROUGH-HOLE
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
uPs/uCs/外围集成电路类型	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

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DiskOnChip 2000 DIP

From 16MByte to 1GByte

Data Sheet, March 2006

Highlights

DiskOnChip 2000 DIP is a member of

M-Systems’ family of DiskOnChip flash disk

products. It is available in densities of 16MByte

to 1GByte.

DiskOnChip 2000 DIP features:

Single-chip plug-n-play flash disk

Low power, single 3.3V or 5V power

supply

16MByte (MB) to 1GByte (GB) density

Simple, easy-to-integrate interface

8KB sized memory window

Boot OS capability

Proprietary TrueFFS

technology for full

hard-disk emulation, high data reliability

and maximum flash lifetime

Software tools for programming,

duplicating, testing, and debugging

Reliability

TrueFFS Software

On-the-fly Reed-Solomon Error Detection

Code/Error Correction Code (EDC/ECC)

Guaranteed data integrity, even after power

failure

Transparent bad-block management

Dynamic and static wear-leveling

Full hard-disk read/write emulation for

transparent file system management

Identical software for all DiskOnChip

capacities

Patented methods to extend flash lifetime,

including:

Dynamic virtual mapping

Dynamic and static wear-leveling

Support for all major OSs, including:

VxWorks, Windows CE/.NET, Linux,

Windows NT/XP, QNX and others.

Operates with TrueFFS Software

Development Kit (SDK) in OS-less

environment.

RoHS Support

RoHS version available (16MB-96MB)

Data Sheet, Rev. 3.9

91-SR-002-42-8L

DiskOnChip 2000 DIP

ABLE OF

ONTENTS

1. Introduction ............................................................................................................................... 5

2. Product Overview ...................................................................................................................... 6

2.1

2.2

2.3

2.4

3.1

3.2

3.3

3.4

3.5

Product Description ............................................................................................................ 6

I/O Operation ...................................................................................................................... 7

Pin Diagram........................................................................................................................ 7

Signal Descriptions............................................................................................................. 8

Overview............................................................................................................................. 9

System Interface................................................................................................................. 9

Boot Block ........................................................................................................................ 10

Error Detection Code/Error Correction Code (EDC/ECC) ................................................ 10

Flash Control .................................................................................................................... 10

3. Theory of Operation .................................................................................................................. 9

4. Operating Modes ..................................................................................................................... 11

5. TrueFFS Technology............................................................................................................... 12

5.1

General Description.......................................................................................................... 12

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

Built-In Operating System Support..................................................................................... 13

TrueFFS Software Development Kit (SDK)........................................................................ 13

File Management................................................................................................................ 13

Bad-Block Management ..................................................................................................... 13

Wear-Leveling .................................................................................................................... 13

Error Detection/Correction.................................................................................................. 14

Special Features through I/O Control (IOCTL) Mechanism ............................................... 15

Compatibility ....................................................................................................................... 15

5.2

Power Failure Management ............................................................................................. 14

5.2.1

5.2.2

5.2.3

5.3

6.1

6.2

7.1

7.2

7.3

7.4

8KB Memory Window ....................................................................................................... 16

Introduction....................................................................................................................... 17

Boot Procedure in PC-Compatible Platforms ................................................................... 17

Design Environment ......................................................................................................... 19

System Interface............................................................................................................... 19

Connecting Signals........................................................................................................... 20

Platform-Specific Issues ................................................................................................... 20

7.4.1

Wait State ........................................................................................................................... 20

6. Booting from DiskOnChip 2000 ............................................................................................. 17

7. Design Considerations ........................................................................................................... 19

Data Sheet, Rev. 3.9

91-SR-002-42-8L

DiskOnChip 2000 DIP

7.4.2

7.4.3

Big and Little Endian Systems............................................................................................ 20

Working with 8/16/32-Bit Systems...................................................................................... 21

8. Product Specifications ........................................................................................................... 22

8.1

Environmental Specifications ........................................................................................... 22

8.1.1

8.1.2

8.1.3

8.1.4

Temperature Ranges ......................................................................................................... 22

DiskOnChip Assembly........................................................................................................ 22

Humidity.............................................................................................................................. 22

Shock and Vibration ........................................................................................................... 22

Absolute Maximum Ratings................................................................................................ 22

Capacitance........................................................................................................................ 23

DC Electrical Characteristics over Operating Range ......................................................... 23

AC Operating Conditions.................................................................................................... 24

Read Cycle Timing ............................................................................................................. 25

Write Cycle Timing ............................................................................................................. 26

8.2

Electrical Specifications.................................................................................................... 22

8.2.1

8.2.2

8.2.3

8.2.4

8.3

Timing Specifications........................................................................................................ 25

8.3.1

8.3.2

8.4

Mechanical Dimensions.................................................................................................... 27

9. Ordering Information............................................................................................................... 28

How to Contact Us ........................................................................................................................ 29

Data Sheet, Rev. 3.9

91-SR-002-42-8L

MD2202-D16-V3-X-P

MD2202-D16-V3-X-P概述

MD2202-D16-V3-X-P规格参数

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