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5962-3826716QNX

产品描述EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32
产品类别存储    存储   
文件大小325KB,共19页
制造商Micross
官网地址https://www.micross.com
下载文档 详细参数 选型对比 全文预览

5962-3826716QNX概述

EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32

5962-3826716QNX规格参数

参数名称属性值
零件包装代码DFP
包装说明CERAMIC, FP-32
针数32
Reach Compliance Codecompli
ECCN代码3A001.A.2.C
最长访问时间250 ns
JESD-30 代码R-CDFP-F32
长度20.828 mm
内存密度1048576 bi
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量32
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织128KX8
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
并行/串行PARALLEL
编程电压5 V
认证状态Qualified
筛选级别MIL-PRF-38535 Class Q
座面最大高度3.81 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
宽度11.05 mm
最长写入周期时间 (tWC)10 ms
Base Number Matches1

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EEPROM
Austin Semiconductor, Inc.
128K x 8 EEPROM
EEPROM Memory
AVAILABLE AS MILITARY
SPECIFICATIONS
SMD 5962-38267
l
MIL-STD-883
l
AS58C1001
PIN ASSIGNMENT
(Top View)
32-Pin CFP (F & SF), 32-Pin CSOJ (DCJ)
RDY/BUSY\
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O 0
I/O 1
I/O 2
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
A15
RES\
WE\
A13
A8
A9
A11
OE\
A10
CE\
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
FEATURES
High speed: 150, 200, and 250ns
l
Data Retention: 10 Years
l
Low power dissipation, active current (20mW/MHz (TYP)),
standby current (100µW(MAX))
l
Single +5V (+10%) power supply
l
Data Polling and Ready/Busy Signals
l
Erase/Write Endurance (10,000 cycles in a page mode)
l
Software Data protection Algorithm
l
Data Protection Circuitry during power on/off
l
Hardware Data Protection with RES pin
l
Automatic Programming:
Automatic Page Write: 10ms (MAX)
128 Byte page size
l
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS58C1001 is a 1 Megabit CMOS
Electrically Erasable Programmable Read Only Memory (EEPROM)
organized as 131, 072 x 8 bits. The AS58C1001 is capable or in
system electrical Byte and Page reprogrammability.
The AS58C1001 achieves high speed access, low power consump-
tion, and a high level of reliability by employing advanced MNOS
memory technology and CMOS process and circuitry technology and
CMOS process and circuitry technology.
This device has a 128-Byte Page Programming function to make its
erase and write operations faster. The AS58C1001 features Data
Polling and a Ready/Busy signal to indicate completion of erase and
programming operations.
This EEPROM provides several levels of data protection. Hard-
ware data protection is provided with the RES pin, in addition to noise
protection on the WE signal and write inhibit during power on and off.
Software data protection is implemented using JEDEC Optional Stan-
dard algorithm.
The AS58C1001 is designed for high reliability in the most de-
manding applications. Data retention is specified for 10 years and
erase/write endurance is guaranteed to a minimum of 10,000 cycles in
the Page Mode.
OPTIONS
l
MARKINGS
l
l
Timing
150ns access
-15
200ns access
-20
250ns access
-25
Packages
Ceramic Flat Pack
F
Radiation Shielded Ceramic FP* SF
Ceramic SOJ
DCJ
Operating Temperature Ranges
-Military (-55
o
C to +125
o
C)
-Industrial (-40
o
C to +85
o
C)
No. 306
No. 305
No. 508
XT
IT
*NOTE: Package lid is connected to ground (Vss).
PIN NAME
A0 to A16
I/O0 to I/O7
OE\
CE\
WE\
Vcc
Vss
RDY/Busy\
RES\
AS58C1001
Rev. 4.0 3/01
FUNCTION
Address input
Data input/output
Output enable
Chip enable
Write enable
Power supply
Ground
Ready busy
Reset
For more products and information
please visit our web site at
www.austinsemiconductor.com
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1

5962-3826716QNX相似产品对比

5962-3826716QNX 5962-3826717QMX 5962-3826717QNX 5962-3826716QMX 5962-3826718QMX 5962-3826718QNX
描述 EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32 EEPROM, 128KX8, 200ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32 EEPROM, 128KX8, 200ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32 EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32 EEPROM, 128KX8, 150ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32 EEPROM, 128KX8, 150ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32
零件包装代码 DFP DFP DFP DFP DFP DFP
包装说明 CERAMIC, FP-32 CERAMIC, FP-32 CERAMIC, FP-32 CERAMIC, FP-32 CERAMIC, FP-32 CERAMIC, FP-32
针数 32 32 32 32 32 32
Reach Compliance Code compli compli compli compli compli compli
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
最长访问时间 250 ns 200 ns 200 ns 250 ns 150 ns 150 ns
JESD-30 代码 R-CDFP-F32 R-CDFP-F32 R-CDFP-F32 R-CDFP-F32 R-CDFP-F32 R-CDFP-F32
长度 20.828 mm 20.828 mm 20.828 mm 20.828 mm 20.828 mm 20.828 mm
内存密度 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
端子数量 32 32 32 32 32 32
字数 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000 128000 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DFP DFP DFP DFP DFP DFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Qualified Qualified Qualified Qualified Qualified Qualified
筛选级别 MIL-PRF-38535 Class Q MIL-PRF-38535 Class Q MIL-PRF-38535 Class Q MIL-PRF-38535 Class Q MIL-PRF-38535 Class Q MIL-PRF-38535 Class Q
座面最大高度 3.81 mm 3.1242 mm 3.81 mm 3.1242 mm 3.1242 mm 3.81 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 FLAT FLAT FLAT FLAT FLAT FLAT
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
宽度 11.05 mm 11.05 mm 11.05 mm 11.05 mm 11.05 mm 11.05 mm
最长写入周期时间 (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
Base Number Matches 1 1 1 1 1 1

 
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