Bus Driver, ALVC/VCX/A Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, 0.50 MM PITCH, TSSOP-56
| 参数名称 | 属性值 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 56 |
| Reach Compliance Code | unknown |
| 系列 | ALVC/VCX/A |
| JESD-30 代码 | R-PDSO-G56 |
| JESD-609代码 | e0 |
| 长度 | 14 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 18 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 56 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 6.1 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 6.1 mm |
| IDT74ALVC162834PA8 | IDT74ALVC162834PF8 | IDT74ALVC162834PV8 | |
|---|---|---|---|
| 描述 | Bus Driver, ALVC/VCX/A Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, 0.50 MM PITCH, TSSOP-56 | Bus Driver, ALVC/VCX/A Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56 | Bus Driver, ALVC/VCX/A Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, 0.635 MM PITCH, SSOP-56 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | TSSOP | SSOP | SSOP |
| 包装说明 | TSSOP, | TSSOP, | SSOP, |
| 针数 | 56 | 56 | 56 |
| Reach Compliance Code | unknown | unknown | unknown |
| 系列 | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A |
| JESD-30 代码 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 14 mm | 11.3 mm | 18.415 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 |
| 端子数量 | 56 | 56 | 56 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟（tpd） | 6.1 ns | 6.1 ns | 6.1 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 2.794 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.4 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 宽度 | 6.1 mm | 4.4 mm | 7.5 mm |
模拟与混合信号
DIY/开源硬件专区
嵌入式系统
stm32/stm8
51单片机
嵌入式系统
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