ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 100kHz BAND WIDTH, PDSO8, LEAD FREE, SMT-8
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | AVAGO |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 8 |
Reach Compliance Code | compliant |
放大器类型 | ISOLATION AMPLIFIER |
标称带宽 (3dB) | 100 MHz |
最大共模电压 | 2.8 V |
最小绝缘电压 | 3750 V |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 9.8 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 4.455 mm |
供电电压上限 | 5.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
最大电压增益 | 8.08 |
最小电压增益 | 7.92 |
宽度 | 6.35 mm |
HCPL-7800A#500E | RNC65H2180BM | RNC65H2180BMBSL | HCPL-7800A#300E | HCPL-7800#E | HCPL-7800-E | HCPL-7800A#E | HCPL-7800A-E | |
---|---|---|---|---|---|---|---|---|
描述 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 100kHz BAND WIDTH, PDSO8, LEAD FREE, SMT-8 | RESISTOR, METAL FILM, 0.25 W, 0.1 %, 50 ppm, 218 ohm, THROUGH HOLE MOUNT, AXIAL LEADED | RESISTOR, METAL FILM, 0.25 W, 0.1 %, 50 ppm, 218 ohm, THROUGH HOLE MOUNT, AXIAL LEADED | ISOLATION AMPLIFIER, 3750 V ISOLATION-MIN, 100 kHz BAND WIDTH, PDSO8, LEAD FREE, SMT-8 | ISOLATION AMPLIFIER, 3750 V ISOLATION-MIN, 100 kHz BAND WIDTH, PDIP8, LEAD FREE, DIP-8 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 100kHz BAND WIDTH, PDIP8, LEAD FREE, DIP-8 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 100kHz BAND WIDTH, PDIP8, LEAD FREE, DIP-8 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 100kHz BAND WIDTH, PDIP8, LEAD FREE, DIP-8 |
包装说明 | SOP, | , | Axial, | SOP, | DIP, | DIP, | DIP, | DIP, |
Reach Compliance Code | compliant | unknown | unknown | compliant | unknown | unknown | unknown | unknown |
端子数量 | 8 | 2 | 2 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 175 °C | 175 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -65 °C | -65 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
表面贴装 | YES | NO | NO | YES | NO | NO | NO | NO |
厂商名称 | AVAGO | - | - | AVAGO | AVAGO | AVAGO | AVAGO | AVAGO |
零件包装代码 | SOIC | - | - | SOIC | DIP | DIP | DIP | DIP |
针数 | 8 | - | - | 8 | 8 | 8 | 8 | 8 |
放大器类型 | ISOLATION AMPLIFIER | - | - | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER |
标称带宽 (3dB) | 100 MHz | - | - | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
最大共模电压 | 2.8 V | - | - | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V |
最小绝缘电压 | 3750 V | - | - | 3750 V | 3750 V | 3750 V | 3750 V | 3750 V |
JESD-30 代码 | R-PDSO-G8 | - | - | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 |
长度 | 9.8 mm | - | - | 9.8 mm | 9.8 mm | 9.8 mm | 9.8 mm | 9.8 mm |
功能数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | - | - | SOP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | TUBULAR PACKAGE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | - | Axial | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.455 mm | - | - | 4.455 mm | 4.7 mm | 4.7 mm | 4.7 mm | 4.7 mm |
供电电压上限 | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
标称供电电压 (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | - | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
最大电压增益 | 8.08 | - | - | 8.08 | 8.24 | 8.24 | 8.08 | 8.08 |
最小电压增益 | 7.92 | - | - | 7.92 | 7.76 | 7.76 | 7.92 | 7.92 |
宽度 | 6.35 mm | - | - | 6.35 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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