This is an advance copy of the dated document. The final document from Defense Automated Printing Service may be slightly
different in format due to electronic conversion processes. Actual technical content will be the same.
The documentation and process conversion
measures necessary to comply with this
amendment shall be completed by 30 November 1998
INCH-POUND
MIL-PRF-19500/474E
AMENDMENT 1
30 August 1998
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, SILICON, MULTIPLE DIODE ARRAYS,
TYPES 1N5768, 1N5770, 1N5772, 1N5774, 1N6100, 1N6101, 1N6496,
1N6506, 1N6507, 1N6508, 1N6509, 1N6510, AND 1N6511
JAN, JANTX, JANTXV, AND JANS
This amendment forms a part of MIL-PRF-19500/474E, dated 3 November 1997 and
is approved for use by all Departments and Agencies of the Department of Defense.
PAGE 2
Pinout label for 1N6106 DIP, 1N6510 FLATPACK; delete “1N6106” and substitute “1N6101”.
PAGE 3
1.5, column headers, column 6; delete “fr” and substitute “t
fr
”. column 7 header; delete “|i
rr
= 20 mA dc” and substitute “i
rr
= 20 mA dc”.
PAGE 12
Dimension table, dimension LL, Min inches column; delete “.285” and substitute “.265”.
PAGE 13
Figure 7, dimension table, LL
1
; delete and substitute as follows:
“ |
| LL
1
|
| ----
|
| .015
|
| ----
|
_ 0.38
|
|“
PAGE 15
4.4.2, delete and substitute as follows:
“4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table VIa (JANS) and table VIb (JAN, JANTX, JANTXV) of MIL-PRF-19500 and as specified
herein. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of
table I, subgroup 2 herein.”
________________________________________________________________________________________________________
The attached insertable replacement pages listed below are replacements for stipulated pages. When the new pages have been
entered in the document, insert the amendment as the cover sheet to the specification.
Replacement page
5
6
Page replaced
5
6
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/474E
AMENDMENT 1
PAGE 16
4.4.2.1; delete subgroup B3.
4.4.2.1, subgroup B7; conditions column; add to end of line; “ Sample size = 45; c = 0.”
4.4.3 delete and substitute as follows:
“4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table VII of MIL-PRF-19500 and as specified herein. Electrical measurements (end-points)
and delta requirements shall be in accordance with the applicable steps of table II herein.”
4.4.3.1; delete:
“2036
Test condition E; 3 oz weight; three bends of 45° for flat packs; three bends of 15° for dips:
omit end leads of configuration 2.”
PAGE 17
4.5.6; delete and substitute as follows:
“4.5.6 Isolation current (IR ); Bridging current(I
Rbr
). These devices shall be subjected to the isolation current/bridging
current tests as specified:
a.
For types 1N5772, 1N5774, 1N6496, 1N6508, and 1N6509, the bridging current shall be measured by supplying the forcing
function to every other interconnect pin and measuring the remaining interconnect pins (excluding common anode and
common cathode pins), IRbr. Repeat the test, reversing the polarity of the forcing function.
For types 1N6100, 1N6101, 1N6511, and 1N6510, the bridging current shall be measured by applying the forcing function to
every other diode (anode and cathode simultaneously) and measuring the remaining diodes (anode and cathode
simultaneously), IRbr. Repeat the test, reversing the polarity of the forcing function.
For types 1N5774, 1N6496, and 1N6509, the isolation current shall be measured between the individual circuits by applying
the forcing function to the anode and cathode of one circuit and measuring to the anode and cathode of other circuit, IRi.
Repeat the test, reversing the polarity of the forcing function.
For types 1N5768 and 1N6506, the forcing function shall be applied to every other anode and measured on the remaining
anodes, IRbr. Repeat the test, reversing the polarity of the forcing function.
For types 1N5770 and 1N6509, the forcing function shall be applied to every other cathode and measured on the remaining
cathodes, IRbr. Repeat the test, reversing the polarity of the forcing function.”
PAGE 18
Table I, subgroup 2, V
F1
, Max limits column; delete “10” and substitute “1.0”
Table I, subgroup 4, V
F4
, conditions column; delete “I
F
=10 mA” and substitute “I
F
=100 mA”.
PAGE 20
Table I, subgroup 7, Bridging current (all devices) and Isolation current tests, units column; delete “mA dc” two places and substitute
“µA dc” two places.
b.
c.
d.
e.
MIL-PRF-19500/474E
AMENDMENT 1
Custodians:
Army - CR
Navy - EC
Air Force - 17
NASA - NA
Review activities:
Army - AR, AV, MI, SM
Navy - AS, CG, MC
Air Force - 19, 85, 99
Preparing activity:
DLA - CC
(Project 5961-1973)
2
MIL-PRF-19500/474E
AMENDMENT 1
Symbol
Inches
Min
Max
.290
.260
---
---
.090
.370
.045
Millimeters
Min
---
6.10
3.18
0.76
0.76
6.10
---
Max
7.37
6.60
---
---
2.29
9.40
1.14
Notes
Symbol
Inches
Min
Max
---
.050
Millimeters
Min
0.13
0.13
Max
---
1.27
Notes
BL
BW
BW
1
BW
2
CH
LL
---
.240
.125
.030
.030
.240
---
3
LO
1
LO
2
LS
LT
LU
LW
.005
.005
7, 8
2
4, 6
5
3
5
10
.050 BSC
.003
---
.010
.008
.006
.280
.019
.015
1.27 BSC
0.08
---
0.25
0.20
0.15
7.11
0.48
0.38
7
TL
LO
NOTES:
1.
Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the shaded area shown.
The manufacturer's identification shall not be used as a pin 1 identification mark. Alternatively, a tab (dimension TL) may be
used to identify pin 1. This tab may be located on either side as shown.
2.
Dimensions LO
2
shall be measured at the point of exit of the lead from the body. Dimension LO
2
shall be .0085 inch (0.216
mm) minimum when lead finish A is solder.
3.
These dimensions allow for off-center lid, meniscus, and glass overrun.
4.
The basic pin spacing is .050 inch (1.27 mm) between centerlines. Each pin centerline shall be located within ±.005 inch (0.13
mm) of its exact longitudinal position relative to pins 1 and 14.
5.
All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the center of the flat, when lead finish is solder.
6.
Eight spaces.
7.
Applies to all four corners (lead numbers 1, 5, 6, and 10).
8.
Dimension LO may be .000 inch (0.00 mm) if lead numbers 1, 5, 6, and 10 bend toward the cavity of the package within one
lead's width from the point of entry of the lead into the body. For all bottom-brazed or side-brazed configurations, dimension LO
shall be measured from the edge of the furthest extension of the metal pad or lead.
9.
Optional configuration. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the
package to cover the leads.
10. Optional, see note 1. If a pin 1 identification mark is used in addition to this tab, the minimum limit of dimension TL does not
apply.
FIGURE 1. Physical dimensions for types 1N5768, 1N5770, and 1N5772 - Continued.
Reprinted without change
5
MIL-PRF-19500/474E
AMENDMENT 1
Symbol
Inches
Min
Max
.095
.019
.006
.280
.260
.280
Millimeters
Min
0.76
0.25
0.08
---
6.10
---
Max
2.41
0.48
0.15
7.11
6.60
7.11
Notes
CH
LW
LT
BL
BW
LU
LS
TL
LL
LO
2
LO
LO
3
α
.030
.010
.003
---
.240
---
5
5
3
3
4, 6
9
.050 BSC
.008
.250
.010
.005
.004
30°
.015
.370
.040
---
---
90°
1.27 BSC
0.20
6.35
0.25
0.13
0.10
30°
0.38
9.40
1.02
---
---
90°
2
7, 8
10
11
FIGURE 2. Physical dimensions for types 1N5774 and 1N6100 .
Superseding page 6 of MIL-PRF-19500/474E
dated 3 November 1997
6
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