EE PLD, CMOS, CQFP84,
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 包装说明 | QFF, |
| Reach Compliance Code | unknown |
| 其他特性 | 128 MACROCELLS; CONFIGURABLE |
| 最大时钟频率 | 50 MHz |
| JESD-30 代码 | S-CQFP-F84 |
| 专用输入次数 | 4 |
| I/O 线路数量 | 64 |
| 端子数量 | 84 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 4 DEDICATED INPUTS, 64 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFF |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 可编程逻辑类型 | EE PLD |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | FLAT |
| 端子位置 | QUAD |
| MACH230-20 | MACH230-15 | MACHLV210A-20JC | MACH120-15 | MACH120-20 | MACHLV210A-15JC | |
|---|---|---|---|---|---|---|
| 描述 | EE PLD, CMOS, CQFP84, | EE PLD, CMOS, PQCC84, | EE PLD, CMOS, | EE PLD, CMOS, PQCC68, | EE PLD, CMOS, PQCC68, | EE PLD, CMOS, |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 包装说明 | QFF, | QCCJ, | , | QCCJ, | QCCJ, | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | 128 MACROCELLS; CONFIGURABLE | 128 MACROCELLS; CONFIGURABLE | 64 MACROCELLS; CONFIGURABLE | 48 MACROCELLS; CONFIGURABLE | 48 MACROCELLS; CONFIGURABLE | 64 MACROCELLS; CONFIGURABLE |
| 最大时钟频率 | 50 MHz | 50 MHz | 80 MHz | 50 MHz | 50 MHz | 50 MHz |
| 专用输入次数 | 4 | 4 | 4 | 4 | 4 | 4 |
| I/O 线路数量 | 64 | 64 | 32 | 48 | 48 | 32 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| 组织 | 4 DEDICATED INPUTS, 64 I/O | 4 DEDICATED INPUTS, 64 I/O | 4 DEDICATED INPUTS, 32 I/O | 4 DEDICATED INPUTS, 48 I/O | 4 DEDICATED INPUTS, 48 I/O | 4 DEDICATED INPUTS, 32 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| JESD-30 代码 | S-CQFP-F84 | S-PQCC-J84 | - | S-PQCC-J68 | S-PQCC-J68 | - |
| 端子数量 | 84 | 84 | - | 68 | 68 | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | QFF | QCCJ | - | QCCJ | QCCJ | - |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | - |
| 封装形式 | FLATPACK | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER | - |
| 表面贴装 | YES | YES | - | YES | YES | - |
| 端子形式 | FLAT | J BEND | - | J BEND | J BEND | - |
| 端子位置 | QUAD | QUAD | - | QUAD | QUAD | - |
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