1
4
A
2
3
5
6
7
NOTES
B
C
Material:
Pin (outer sleeve) :
Brass,machined, CuZn38Pb2
Clip(contact 4 finger) :
Phosphor Bronze
Insulator body(black) :
Glass filled thermoplastic polyester UL94V-0
Electrical
Current rating :
3 Amps/contact max.
Contact resistance :
≦
4mΩ /contact
Insulation resistance :
≧
10000MΩ at 500VAC
Rated voltage :
100 VRMS /150VDC
Mechanical
Operating temperature :
Gold plated:-55
°
C to +125
°
C
(Continuous)
-67
°
F to +105
°
F
Tin plated:-40
°
C to +105
°
C
Average insertion force with steel pin of:
∅
0.43mm/0.017" < 250g
Average withdrawal force with steel pin of
∅
0.43mm/0.017" >50g
Mechanical life :
min.200
Applications and features:
1.The open frame is most common type.
2.The open body design gives better access (for cleaning and inspections)
to air -cooling.
3.Side and end stackable.
4.High retention design prevents IC walkout during heavy vibration.
5.Closed bottom sleeve for 100% anti-wicking of silder.
6.Twist free construction.
Environmental data
Solderability (IEC 60068-2-20. Ta) :235
°
C, 2s
Resistance to soldering heat (IEC 60068-2-20. Tb) :
-Through hole mount components :260
°
C, 10s
A
B
C
D
E
Order Code:
AR xx- x x
No. of contact
06 ~ 64
F
Versions
-TT
- Standard
/7-TT
- Only for 24+28 poles*
(Dim C: 7.62)
Plating
HZL
- Sleeve tin / clip gold flash
HZL/01 - Sleeve tin / clip 10u" gold
HZL/07 - Sleeve tin / clip 30u" gold
HGL
- Sleeve gold flash / clip gold flash
Contact
06
08
10
14
16
18
20
22
24*
24
28*
Dim A
7.62
10.16
12.70
17.78
20.32
22.86
Dim B
5.08
7.62
10.16
15.24
17.78
20.32
Dim C
7.62
Dim D
25.40
27.94
30.48
30.48
35.56
22.86
25.40
27.94
27.94
33.02
7.62
7.62
7.62
7.62
7.62
7.62
10.16
7.62
15.24
7.62
10.16
10.16
10.16
10.16
10.16
10.16
10.16
12.70
D
10.16
17.78
10.16
E
28
32
35.56
40.64
33.02
38.10
15.24
15.24
17.78
17.78
PCB LAYOUT
F
Scale
X.
X.X
X.XX
DIM
X.°
Angle
Free
TOLERANCE
±0.50
±0.30
±0.10
TOL
2
1
Add "HGL"-Version,corrected P/N code 28.01.2014
Add sheet 2
16.08.2012
A. Plate
Lucas
Approved
16.08.2012
Drawn
Date
23.07.2012
RoHS compliant
Unit:mm
Name
Customer-No.
G
Lucas
G
Winnie
ASSMANN WSW-No.
AR xx-x x
±
1°
0
Drawn
23.07.2012
Lucas
Drawing-No.
H
1
2
ASS 4852 CO
TOL
Id.
Modification
Date
Name
rev02
H
3
4
5
Replace
Sheet
1/2
6
7
1
4
A
NOTES
2
3
5
6
7
A
B
C
D
Material:
Pin (outer sleeve) :
Brass,machined, CuZn38Pb2
Clip(contact 4 finger) :
Phosphor Bronze
Insulator body(black) :
Glass filled thermoplastic polyester UL94V-0
Electrical
Current rating :
3 Amps/contact max.
Contact resistance :
≦
4mΩ /contact
Insulation resistance :
≧
10000MΩ at 500VAC
Rated voltage :
100 VRMS /150VDC
Mechanical
Operating temperature :
Gold plated:-55
°
C to +125
°
C
(Continuous)
-67
°
F to +105
°
F
Tin plated:-40
°
C to +105
°
C
Average insertion force with steel pin of:
∅
0.43mm/0.017" < 250g
Average withdrawal force with steel pin of
∅
0.43mm/0.017" >50g
Mechanical life :
min.200
Applications and features:
1.The open frame is most common type.
2.The open body design gives better access (for cleaning and inspections)
to air -cooling.
3.Side and end stackable.
4.High retention design prevents IC walkout during heavy vibration.
5.Closed bottom sleeve for 100% anti-wicking of silder.
6.Twist free construction.
Environmental data
Solderability (IEC 60068-2-20. Ta) :235
°
C, 2s
Resistance to soldering heat (IEC 60068-2-20. Tb) :
-Through hole mount components :260
°
C, 10s
B
C
D
Contact
36
40
42
48
50
52
50
52
64
Dim A
E
F
PCB LAYOUT
45.72
50.80
53.34
60.96
63.50
66.04
63.50
66.04
81.28
Dim B Dim C
15.24
15.24
15.24
15.24
15.24
15.24
22.86
22.86
22.86
Dim D
43.18
48.26
50.80
58.42
60.96
63.50
60.96
63.50
78.74
17.78
17.78
17.78
17.78
17.78
17.78
25.40
25.40
25.40
E
F
Scale
X.
X.X
X.XX
DIM
Free
TOLERANCE
±0.50
±0.30
±0.10
2 Add "HGL"-Version,corrected P/N code 28.01.2014 A. Plate
TOL
1
0
Add sheet 2
Drawn
16.08.2012
23.07.2012
Lucas
Lucas
Approved
16.08.2012
Drawn
Date
23.07.2012
RoHS compliant
Unit:mm
Name
Customer-No.
G
Lucas
G
Winnie
ASSMANN WSW-No.
AR xx-x x
Drawing-No.
H
Angle
TOL
ASS 4852 CO
Id.
Modification
Date
Name
rev02
H
1
2
3
4
5
Replace
Sheet
2/2
6
7
NXP MCU
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