1.8A, 600V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
包装说明 | E-LELF-R2 |
针数 | 2 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
应用 | GENERAL PURPOSE |
外壳连接 | ISOLATED |
配置 | SINGLE |
二极管元件材料 | SILICON |
二极管类型 | RECTIFIER DIODE |
JESD-30 代码 | E-LELF-R2 |
最大非重复峰值正向电流 | 25 A |
元件数量 | 1 |
相数 | 1 |
端子数量 | 2 |
最大输出电流 | 1.8 A |
封装主体材料 | GLASS |
封装形状 | ELLIPTICAL |
封装形式 | LONG FORM |
认证状态 | Not Qualified |
最大重复峰值反向电压 | 600 V |
最大反向恢复时间 | 3 µs |
表面贴装 | YES |
端子形式 | WRAP AROUND |
端子位置 | END |
PS07J | PS07D,135 | PS07D,115 | PS07J,115 | PS07J,135 | PS07D | PS07G,135 | PS07G | PS07G,115 | |
---|---|---|---|---|---|---|---|---|---|
描述 | 1.8A, 600V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 200V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 200V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 600V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 600V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 200V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 400V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 400V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | 1.8A, 400V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2 |
包装说明 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 |
针数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
应用 | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
外壳连接 | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
二极管类型 | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
JESD-30 代码 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 |
最大非重复峰值正向电流 | 25 A | 25 A | 25 A | 25 A | 25 A | 25 A | 25 A | 25 A | 25 A |
元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
相数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
最大输出电流 | 1.8 A | 1.8 A | 1.8 A | 1.8 A | 1.8 A | 1.8 A | 1.8 A | 1.8 A | 1.8 A |
封装主体材料 | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS |
封装形状 | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL |
封装形式 | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大重复峰值反向电压 | 600 V | 200 V | 200 V | 600 V | 600 V | 200 V | 400 V | 400 V | 400 V |
最大反向恢复时间 | 3 µs | 3 µs | 3 µs | 3 µs | 3 µs | 3 µs | 3 µs | 3 µs | 3 µs |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
端子形式 | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND | WRAP AROUND |
端子位置 | END | END | END | END | END | END | END | END | END |
厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
最高工作温度 | - | 150 °C | 150 °C | 150 °C | 150 °C | - | 150 °C | - | 150 °C |
最低工作温度 | - | -65 °C | -65 °C | -65 °C | -65 °C | - | -65 °C | - | -65 °C |
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