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IDT709179L9PFG

产品描述Dual-Port SRAM, 32KX9, 20ns, CMOS, PQFP100, TQFP-100
产品类别存储    存储   
文件大小180KB,共15页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

IDT709179L9PFG概述

Dual-Port SRAM, 32KX9, 20ns, CMOS, PQFP100, TQFP-100

IDT709179L9PFG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明TQFP-100
针数100
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间20 ns
JESD-30 代码S-PQFP-G100
JESD-609代码e3
长度14 mm
内存密度294912 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级3
功能数量1
端子数量100
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX9
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm

文档预览

下载PDF文档
PRELIMINARY
HIGH-SPEED 32K x 9
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
.eatures
x
x
IDT709179L
x
x
x
x
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial: 7.5/9/12ns (max.)
– Industrial: 9ns (max)
Low-power operation
– IDT709179L
Active: 1.2W (typ.)
Standby: 2.5mW (typ.)
Flow-Through or Pipelined output mode on either Port via
the
FT/PIPE
pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
x
x
x
x
additional logic
Full synchronous operation on both ports
– 4ns setup to clock and 0ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 7.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 12ns cycle time, 83MHz operation in Pipelined output mode
TTL- compatible, single 5V (±10%) power supply
Industrial temperature range (–40°C to +85°C) is
available for selected speeds
Available in a 100-pin Thin Quad Flatpack (TQFP) package
.unctional Block Diagram
R/W
L
OE
L
CE
0L
CE
1L
R/W
R
OE
R
CE
0R
CE
1R
1
0
0/1
1
0
0/1
FT/PIPE
L
0/1
1
0
0
1
0/1
FT/PIPE
R
I/O
0L
- I/O
8L
I/O
0R
- I/O
8R
I/O
Control
I/O
Control
A
14L
A
0L
CLK
L
ADS
L
CNTEN
L
CNTRST
L
Counter/
Address
Reg.
MEMORY
ARRAY
Counter/
Address
Reg.
A
14R
A
0R
CLK
R
ADS
R
CNTEN
R
CNTRST
R
5644 drw 01
AUGUST 2001
1
©2001 Integrated Device Technology, Inc.
DSC-5644/1

IDT709179L9PFG相似产品对比

IDT709179L9PFG IDT709179L12PFG 709179L12PFG 709179L9PFGI 709179L9PFG IDT709179L9PFGI IDT709179L7PFG
描述 Dual-Port SRAM, 32KX9, 20ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 32KX9, 25ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 32KX9, 25ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 32KX9, 20ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 32KX9, 20ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 32KX9, 20ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 32KX9, 18ns, CMOS, PQFP100, TQFP-100
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP QFP QFP QFP
包装说明 TQFP-100 TQFP-100 TQFP-100 TQFP-100 TQFP-100 TQFP-100 TQFP-100
针数 100 100 100 100 100 100 100
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.B EAR99 EAR99 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
最长访问时间 20 ns 25 ns 25 ns 20 ns 20 ns 20 ns 18 ns
JESD-30 代码 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609代码 e3 e3 e3 e3 e3 e3 e3
长度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
内存密度 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9 9 9 9
湿度敏感等级 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1
端子数量 100 100 100 100 100 100 100
字数 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
字数代码 32000 32000 32000 32000 32000 32000 32000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C 70 °C
组织 32KX9 32KX9 32KX9 32KX9 32KX9 32KX9 32KX9
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

 
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