OT PLD, 80ns, PLA-Type, TTL, CDIP28,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| 架构 | PLA-TYPE |
| JESD-30 代码 | R-XDIP-T28 |
| JESD-609代码 | e0 |
| 输入次数 | 16 |
| 输出次数 | 8 |
| 产品条款数 | 48 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 80 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 82S101/BXA | 82S100/BYA | 82S100/B3A | 82S100/BXA | 82S101/B3A | 82S101/BYA | |
|---|---|---|---|---|---|---|
| 描述 | OT PLD, 80ns, PLA-Type, TTL, CDIP28, | OT PLD, 80ns, PLA-Type, TTL, CDFP28, | OT PLD, 80ns, PLA-Type, TTL, CQCC28, | OT PLD, 80ns, PLA-Type, TTL, CDIP28, | OT PLD, 80ns, PLA-Type, TTL, CQCC28, | OT PLD, 80ns, PLA-Type, TTL, CDFP28, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 架构 | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE |
| JESD-30 代码 | R-XDIP-T28 | R-XDFP-F28 | S-XQCC-N28 | R-XDIP-T28 | S-XQCC-N28 | R-XDFP-F28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 输入次数 | 16 | 16 | 16 | 16 | 16 | 16 |
| 输出次数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 产品条款数 | 48 | 48 | 48 | 48 | 48 | 48 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DFP | QCCN | DIP | QCCN | DFP |
| 封装等效代码 | DIP28,.6 | FL28,.4 | LCC28,.45SQ | DIP28,.6 | LCC28,.45SQ | FL28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
| 包装说明 | DIP, DIP28,.6 | - | QCCN, LCC28,.45SQ | DIP, DIP28,.6 | QCCN, LCC28,.45SQ | - |
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