Line Driver/Receiver, BIPolar, CDIP14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
最大输出低电流 | 0.01 A |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
最大接收延迟 | 85 ns |
最大压摆率 | 26 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
MC1489AF | MC1489AN | MC1489N | MC1489AD | MC1489D | MC1489F | |
---|---|---|---|---|---|---|
描述 | Line Driver/Receiver, BIPolar, CDIP14, | Line Driver/Receiver, BIPolar, PDIP14, | Line Driver/Receiver, BIPolar, PDIP14, | Line Driver/Receiver, BIPolar, PDSO14, | Line Driver/Receiver, BIPolar, PDSO14, | Line Driver/Receiver, BIPolar, CDIP14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-XDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最大输出低电流 | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
封装代码 | DIP | DIP | DIP | SOP | SOP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大接收延迟 | 85 ns | 85 ns | 85 ns | 85 ns | 85 ns | 85 ns |
最大压摆率 | 26 mA | 26 mA | 26 mA | 26 mA | 26 mA | 26 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | YES | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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