Flash, 8MX8, 35ns, PBGA48, 6 X 8.50 MM, TBGA-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA48,6X8,32 |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.1.A |
| 最长访问时间 | 35 ns |
| 命令用户界面 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-PBGA-B48 |
| 长度 | 8.5 mm |
| 内存密度 | 67108864 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 部门数/规模 | 1K |
| 端子数量 | 48 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA48,6X8,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 页面大小 | 512 words |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 编程电压 | 2.7 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 座面最大高度 | 1 mm |
| 部门规模 | 8K |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.02 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | NO |
| 宽度 | 6 mm |
| K9F6408U0C-BIB0 | K9F6408U0C-VCB0 | K9F6408U0C-BCB0 | K9F6408U0C-TCB0 | K9F6408U0C-TIB0 | K9F6408U0C-VIB0 | K9F6408Q0C-BIB0 | K9F6408Q0C-BCB0 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 8MX8, 35ns, PBGA48, 6 X 8.50 MM, TBGA-48 | Flash, 8MX8, 35ns, PDSO48, 12 X 17 X 0.70 MM, PLASTIC, WSOP1-48 | Flash, 8MX8, 35ns, PBGA48, 6 X 8.50 MM, TBGA-48 | Flash, 8MX8, 35ns, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44 | Flash, 8MX8, 35ns, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44 | Flash, 8MX8, 35ns, PDSO48, 12 X 17 X 0.70 MM, PLASTIC, WSOP1-48 | Flash, 8MX8, 35ns, PBGA48, 6 X 8.50 MM, TBGA-48 | Flash, 8MX8, 35ns, PBGA48, 6 X 8.50 MM, TBGA-48 |
| 零件包装代码 | BGA | SOIC | BGA | TSOP2 | TSOP2 | SOIC | BGA | BGA |
| 包装说明 | VFBGA, BGA48,6X8,32 | VSSOP, TSSOP48,.71,20 | VFBGA, BGA48,6X8,32 | TSOP2, TSOP40/44,.46,32 | TSOP2, TSOP40/44,.46,32 | VSSOP, TSSOP48,.71,20 | VFBGA, BGA48,6X8,32 | VFBGA, BGA48,6X8,32 |
| 针数 | 48 | 48 | 48 | 44 | 44 | 48 | 48 | 48 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | unknown | compliant | compliant |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 最长访问时间 | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns |
| 命令用户界面 | YES | YES | YES | YES | YES | YES | YES | YES |
| 数据轮询 | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PBGA-B48 | R-PDSO-G48 | R-PBGA-B48 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G48 | R-PBGA-B48 | R-PBGA-B48 |
| 长度 | 8.5 mm | 15.4 mm | 8.5 mm | 18.41 mm | 18.41 mm | 15.4 mm | 8.5 mm | 8.5 mm |
| 内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 1K | 1K | 1K | 1K | 1K | 1K | 1K | 1K |
| 端子数量 | 48 | 48 | 48 | 40 | 40 | 48 | 48 | 48 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 8MX8 | 8MX8 | 8MX8 | 8MX8 | 8MX8 | 8MX8 | 8MX8 | 8MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | VSSOP | VFBGA | TSOP2 | TSOP2 | VSSOP | VFBGA | VFBGA |
| 封装等效代码 | BGA48,6X8,32 | TSSOP48,.71,20 | BGA48,6X8,32 | TSOP40/44,.46,32 | TSOP40/44,.46,32 | TSSOP48,.71,20 | BGA48,6X8,32 | BGA48,6X8,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 页面大小 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.8 V | 1.8 V |
| 编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 1.8 V | 1.8 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | YES | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 1 mm | 0.7 mm | 1 mm | 1.2 mm | 1.2 mm | 0.7 mm | 1 mm | 1 mm |
| 部门规模 | 8K | 8K | 8K | 8K | 8K | 8K | 8K | 8K |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.015 mA | 0.015 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 1.95 V | 1.95 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | BALL | GULL WING | BALL | GULL WING | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | DUAL | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| 切换位 | NO | NO | NO | NO | NO | NO | NO | NO |
| 宽度 | 6 mm | 12 mm | 6 mm | 10.16 mm | 10.16 mm | 12 mm | 6 mm | 6 mm |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | - | - |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
