SS22L thru SS215L
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Low power loss, high efficiency
- Ideal for automated placement
- Guardring for overvoltage protection
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
Surface Mount Schottky Barrier Rectifier
MECHANICAL DATA
Case:
Sub SMA
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.019 g (approximately)
Sub SMA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@ 2A
Maximum reverse current @ rated VR T
J
=25
℃
T
J
=100
℃
T
J
=125
℃
Voltage rate of change (Rated V
R
)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
0.50
0.4
I
R
dV/dt
R
θJL
R
θJA
T
J
T
STG
- 55 to +125
- 55 to +150
15
-
10
-
10000
17
75
- 55 to +150
SYMBOL
SS
22L
22L
20
14
20
SS
23L
23L
30
21
30
SS
24L
24L
40
28
40
SS
25L
25L
50
35
50
2
50
0.70
0.85
0.1
-
5
V/μs
O
SS
26L
26L
60
42
60
SS
29L
29L
90
63
90
SS
20L
100
70
100
SS
2AL
150
105
150
210L 215L
UNIT
V
V
V
A
A
0.95
V
mA
C/W
O
O
C
C
Document Number: DS_D1308031
Version: L13
SS22L thru SS215L
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
QUALIFIED
PACKING
CODE
RU
RV
RT
MT
RQ
MQ
R3
RF
R2
M2
RH
MH
Note 1: "x" defines voltage from 20V (SS22L) to 150V (SS215L)
GREEN COMPOUND
CODE
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
1,800 / 7" Plastic reel (8mm tape)
3,000 / 7" Plastic reel (8mm tape)
7,500 / 13" Paper reel (8mm tape)
7,500 / 13" Plastic reel (8mm tape)
10,000 / 13" Paper reel (8mm tape)
10,000 / 13" Plastic reel (8mm tape)
1,800 / 7" Plastic reel (12mm tape)
3,000 / 7" Plastic reel (12mm tape)
7,500 / 13" Paper reel (12mm tape)
7,500 / 13" Plastic reel (12mm tape)
10,000 / 13" Paper reel (12mm tape)
10,000 / 13" Plastic reel (12mm tape)
PACKAGE
PACKING
SS2XL
(Note 1)
Prefix "H"
Suffix "G"
EXAMPLE
PREFERRED P/N PART NO.
SS26L RU
SS26L RUG
SS26LHRU
SS26L
SS26L
SS26L
H
AEC-Q101
QUALIFIED
PACKING CODE
RU
RU
RU
G
Green compound
AEC-Q101 qualified
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT (A
2.5
2
1.5
1
0.5
0
50
60
70
80
90
100 110 120 130 140 150 160 170
LEAD TEMPERATURE (
o
C)
RESISTIVE OR
INDUCTIVE LOAD
SS22L-SS24L
SS25L-SS215L
PEAK FORWARD SURGE CURRENT
(A)
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
50
40
30
20
10
0
1
10
100
8.3ms Single Half Sine-Wave
JEDEC Method
NUMBER OF CYCLES AT 60 Hz
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
100
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
100
SS22L-SS24L
SS25L-SS215L
TJ=125℃
INSTANTANEOUS FORWARD
A
CURRENT (A)
10
SS25L-SS26L
INSTANTANEOUS REVERSE
A
CURRENT (mA)
10
1
SS215L
SS22L-SS24L
0.1
1
TJ=75℃
0.01
TJ=25℃
0
20
40
60
80
100
120
140
SS29L-SS210L
0.001
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
FORWARD VOLTAGE (V)
PERCENT OF RATED PEAK REVERSE VOLYAGE(%)
Document Number: DS_D1308031
Version: L13
SS22L thru SS215L
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
1000
TRANSIENT THERMAL IMPEDANCE (℃/W)
JUNCTION CAPACITANCE (pF)
a
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
100
10
100
1
f=1.0MHz
Vslg=50mVp-p
10
0.1
1
10
100
REVERSE VOLTAGE (V)
0.1
0.01
0.1
1
T-PULSE DURATION(S)
10
100
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
1.70
2.70
0.16
1.23
0.80
3.40
2.45
0.35
0.00
Max
1.90
2.90
0.30
1.43
1.20
3.80
2.60
0.85
0.10
Unit (inch)
Min
0.067
0.106
0.006
0.048
0.031
0.134
0.096
0.014
0.000
Max
0.075
0.114
0.012
0.056
0.047
0.150
0.102
0.033
0.004
DIM.
B
C
D
E
F
G
H
I
J
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
1.4
1.2
3.1
1.9
4.3
Unit (inch)
0.055
0.047
0.122
0.075
0.169
MARKING DIAGRAM
P/N
G
YW
F
Document Number: DS_D1308031
= Marking Code
= Green Compound
= Date Code
= Factory Code
Version: L13
SS22L thru SS215L
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1308031
Version: L13
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