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SST29VE010-200-4I-EHE

产品描述128K X 8 FLASH 2.7V PROM, 200 ns, PDSO32, 8 X 20 MM, ROHS COMPLIANT, MO-142BD, TSOP1-32
产品类别存储    存储   
文件大小465KB,共30页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准  
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SST29VE010-200-4I-EHE概述

128K X 8 FLASH 2.7V PROM, 200 ns, PDSO32, 8 X 20 MM, ROHS COMPLIANT, MO-142BD, TSOP1-32

SST29VE010-200-4I-EHE规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Microchip(微芯科技)
零件包装代码TSOP1
包装说明TSOP1,
针数32
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间200 ns
JESD-30 代码R-PDSO-G32
JESD-609代码e3
长度18.4 mm
内存密度1048576 bit
内存集成电路类型FLASH
内存宽度8
功能数量1
端子数量32
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织128KX8
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
编程电压2.7 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
类型NOR TYPE
宽度8 mm
最长写入周期时间 (tWC)10 ms

文档预览

下载PDF文档
1 Mbit (128K x8) Page-Write EEPROM
SST29EE010 / SST29VE010
SST29EE / VE0101Mb (x8) Page-Write, Small-Sector flash memories
Data Sheet
FEATURES:
• Single Voltage Read and Write Operations
– 4.5-5.5V for SST29EE010
– 2.7-3.6V for SST29VE010
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption
– Active Current: 20 mA (typical) for 5V and
10 mA (typical) for 2.7V
– Standby Current: 10 µA (typical)
• Fast Page-Write Operation
– 128 Bytes per Page, 1024 Pages
– Page-Write Cycle: 5 ms (typical)
– Complete Memory Rewrite: 5 sec (typical)
– Effective Byte-Write Cycle Time: 39 µs (typical)
• Fast Read Access Time
– 4.5-5.5V operation: 70 and 90 ns
– 2.7-3.6V operation: 150 and 200 ns
• Latched Address and Data
• Automatic Write Timing
– Internal V
PP
Generation
• End of Write Detection
– Toggle Bit
– Data# Polling
• Hardware and Software Data Protection
• Product Identification can be accessed via
Software Operation
• TTL I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 32-lead PLCC
– 32-lead TSOP (8mm x 14mm, 8mm x 20mm)
– 32-pin PDIP
• All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST29EE/VE010 are 128K x8 CMOS Page-Write
EEPROMs manufactured with SST’s proprietary, high-per-
formance CMOS SuperFlash technology. The split-gate
cell design and thick-oxide tunneling injector attain better
reliability and manufacturability compared with alternate
approaches. The SST29EE/VE010 write with a single
power supply. Internal Erase/Program is transparent to the
user. The SST29EE/VE010 conform to JEDEC standard
pinouts for byte-wide memories.
Featuring high performance Page-Write, the SST29EE/
VE010 provide a typical Byte-Write time of 39 µsec. The
entire memory, i.e., 128 Kbyte, can be written page-by-
page in as little as 5 seconds, when using interface features
such as Toggle Bit or Data# Polling to indicate the comple-
tion of a Write cycle. To protect against inadvertent write,
the SST29EE/VE010 have on-chip hardware and Software
Data Protection schemes. Designed, manufactured, and
tested for a wide spectrum of applications, the SST29EE/
VE010 are offered with a guaranteed Page-Write endur-
ance of 10,000 cycles. Data retention is rated at greater
than 100 years.
The SST29EE/VE010 are suited for applications that
require convenient and economical updating of pro-
gram, configuration, or data memory. For all system
applications, the SST29EE/VE010 significantly
improve performance and reliability, while lowering
power consumption. The SST29EE/VE010 improve
flexibility while lowering the cost for program, data, and
configuration storage applications.
To meet high density, surface mount requirements, the
SST29EE/VE010 are offered in 32-lead PLCC and 32-lead
TSOP packages. A 600-mil, 32-pin PDIP package is also
available. See Figures 1, 2, and 3 for pin assignments.
Device Operation
The SST Page-Write EEPROM offers in-circuit electrical
write capability. The SST29EE/VE010 does not require
separate Erase and Program operations. The internally
timed Write cycle executes both erase and program trans-
parently to the user. The SST29EE/VE010 have industry
standard optional Software Data Protection, which SST
recommends always to be enabled. The SST29EE/VE010
are compatible with industry standard EEPROM pinouts
and functionality.
©2005 Silicon Storage Technology, Inc.
S71061-11-000
9/05
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
SSF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST29VE010-200-4I-EHE相似产品对比

SST29VE010-200-4I-EHE SST29VE010-200-4I-NHE SST29VE010-200-4I-WHE SST29EE010-70-4I-EHE
描述 128K X 8 FLASH 2.7V PROM, 200 ns, PDSO32, 8 X 20 MM, ROHS COMPLIANT, MO-142BD, TSOP1-32 128K X 8 FLASH 2.7V PROM, 200 ns, PQCC32, ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 128K X 8 FLASH 2.7V PROM, 200 ns, PDSO32, 8 X 14 MM, ROHS COMPLIANT, MO-142BA, TSOP1-32 128K X 8 FLASH 5V PROM, 70 ns, PDSO32, 8 X 20 MM, ROHS COMPLIANT, MO-142BD, TSOP1-32
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
零件包装代码 TSOP1 QFJ TSOP1 TSOP1
包装说明 TSOP1, ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 8 X 14 MM, ROHS COMPLIANT, MO-142BA, TSOP1-32 8 X 20 MM, ROHS COMPLIANT, MO-142BD, TSOP1-32
针数 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
最长访问时间 200 ns 200 ns 200 ns 70 ns
JESD-30 代码 R-PDSO-G32 R-PQCC-J32 R-PDSO-G32 R-PDSO-G32
JESD-609代码 e3 e3 e3 e3
长度 18.4 mm 13.97 mm 12.4 mm 18.4 mm
内存密度 1048576 bit 1048576 bit 1048576 bit 1048576 bit
内存集成电路类型 FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8
功能数量 1 1 1 1
端子数量 32 32 32 32
字数 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
组织 128KX8 128KX8 128KX8 128KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1 QCCJ TSOP1 TSOP1
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE CHIP CARRIER SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260
编程电压 2.7 V 2.7 V 2.7 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 3.556 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 5.5 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 4.5 V
标称供电电压 (Vsup) 3 V 3 V 3 V 5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING J BEND GULL WING GULL WING
端子节距 0.5 mm 1.27 mm 0.5 mm 0.5 mm
端子位置 DUAL QUAD DUAL DUAL
处于峰值回流温度下的最长时间 40 40 40 40
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 8 mm 11.43 mm 8 mm 8 mm
最长写入周期时间 (tWC) 10 ms 10 ms 10 ms 10 ms

 
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