BCT/FBT SERIES, 8-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDFP24, CERAMIC, FP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-GDFP-F24 |
| 长度 | 14.36 mm |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 14.4 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.29 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 9.09 mm |
| SN54BCT544W | SN74BCT544NT | SN54BCT544JT | |
|---|---|---|---|
| 描述 | BCT/FBT SERIES, 8-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDFP24, CERAMIC, FP-24 | Octal Registered Transceivers 24-PDIP 0 to 70 | BCT/FBT SERIES, 8-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP | DIP | DIP |
| 包装说明 | DFP, | DIP, DIP24,.3 | DIP, DIP24,.3 |
| 针数 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | not_compliant | not_compliant |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT |
| JESD-30 代码 | R-GDFP-F24 | R-PDIP-T24 | R-GDIP-T24 |
| 长度 | 14.36 mm | 31.64 mm | 32.005 mm |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 14.4 ns | 13.4 ns | 14.4 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.29 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO |
| 技术 | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 宽度 | 9.09 mm | 7.62 mm | 7.62 mm |
| 是否Rohs认证 | - | 不符合 | 不符合 |
| 控制类型 | - | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | - | BIDIRECTIONAL | BIDIRECTIONAL |
| 最大I（ol） | - | 0.064 A | 0.048 A |
| 封装等效代码 | - | DIP24,.3 | DIP24,.3 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 5 V | 5 V |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED |
| 翻译 | - | N/A | N/A |
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