Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.6 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 桶式移位器 | NO |
| 边界扫描 | NO |
| 最大时钟频率 | 3.125 MHz |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-CDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 32.0675 mm |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5,12 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 座面最大高度 | 5.588 mm |
| 最大压摆率 | 100 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | MOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MATH PROCESSOR, COPROCESSOR |
| MD8231A-3B | ID8231A-3 | ID8231A-8 | D8231A-8 | MD8231A-8B | D8231A-3 | D8231A | |
|---|---|---|---|---|---|---|---|
| 描述 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Math Coprocessor, 8-Bit, MOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 3.125 MHz | 3.125 MHz | 2.08 MHz | 2.08 MHz | 2.08 MHz | 3.125 MHz | 4 MHz |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | - | -55 °C | - | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm |
| 最大压摆率 | 100 mA | 95 mA | 95 mA | 95 mA | 100 mA | 95 mA | 95 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR |
| 最大供电电压 | - | 5.5 V | 5.5 V | 5.25 V | - | 5.25 V | 5.25 V |
| 最小供电电压 | - | 4.5 V | 4.5 V | 4.75 V | - | 4.75 V | 4.75 V |
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