IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,CERAMIC
| 参数名称 | 属性值 |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | compli |
| JESD-30 代码 | R-XDIP-T14 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3/15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-01-051-3011 | CD4007AF | 5962-00-232-0101 | |
|---|---|---|---|
| 描述 | IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,CERAMIC | INVERT GATE | IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,CERAMIC |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | compli | compliant | compliant |
| JESD-30 代码 | R-XDIP-T14 | R-CDIP-T14 | R-XDIP-T14 |
| 端子数量 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
| 封装代码 | DIP | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 3/15 V | 3/15 V | 3/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
| 表面贴装 | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 厂商名称 | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
stm32/stm8
stm32/stm8
实时操作系统RTOS
求职招聘
嵌入式系统
DSP 与 ARM 处理器
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