MMBTH10M3T5G
NPN VHF/UHF Transistor
The MMBTH10M3T5G device is a spin−off of our popular
SOT−23 three−leaded device. It is designed for general purpose
VHF/UHF applications and is housed in the SOT−723 surface mount
package. This device is ideal for low−power surface mount
applications where board space is at a premium.
Features
http://onsemi.com
•
Reduces Board Space
•
This is a Halide−Free Device
•
This is a Pb−Free Device
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
Collector
−Base
Voltage
Emitter−Base Voltage
Symbol
V
CEO
V
CBO
V
EBO
Value
25
30
3.0
Unit
Vdc
Vdc
Vdc
1
BASE
COLLECTOR
3
2
EMITTER
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
FR−5 Board (Note 1)
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Total Device Dissipation
Alumina Substrate, (Note 2) T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
Symbol
P
D
Max
265
2.1
R
qJA
P
D
470
640
5.1
R
qJA
T
J
, T
stg
195
−55
to
+150
Unit
mW
mW/°C
1
3
MARKING
DIAGRAM
SOT−723
CASE 631AA
STYLE 1
AJ M
2
°C/W
mW
mW/°C
°C/W
°C
AJ
M
= Specific Device Code
= Date Code
ORDERING INFORMATION
Device
MMBTH10M3T5G
Package
Shipping
†
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
SOT−723 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2009
January, 2009
−
Rev. 0
1
Publication Order Number:
MMBTH10M3/D
MMBTH10M3T5G
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
(I
C
= 1.0 mAdc, I
B
= 0)
Collector−Base Breakdown Voltage
(I
C
= 100
μAdc,
I
E
= 0)
Emitter−Base Breakdown Voltage
(I
E
= 10
μAdc,
I
C
= 0)
Collector Cutoff Current
(V
CB
= 25 Vdc, I
E
= 0)
Emitter Cutoff Current
(V
EB
= 2.0 Vdc, I
C
= 0)
ON CHARACTERISTICS
DC Current Gain
(I
C
= 4.0 mAdc, V
CE
= 10 Vdc)
Collector−Emitter Saturation Voltage
(I
C
= 4.0 mAdc, I
B
= 0.4 mAdc)
Base−Emitter On Voltage
(I
C
= 4.0 mAdc, V
CE
= 10 Vdc)
SMALL−SIGNAL CHARACTERISTICS
Current−Gain
−
Bandwidth Product
(I
C
= 4.0 mAdc, V
CE
= 10 Vdc, f = 100 MHz)
Collector−Base Capacitance
(V
CB
= 10 Vdc, I
E
= 0, f = 1.0 MHz)
Common−Base Feedback Capacitance
(V
CB
= 10 Vdc, I
E
= 0, f = 1.0 MHz)
Collector Base Time Constant
(I
C
= 4.0 mAdc, V
CB
= 10 Vdc, f = 31.8 MHz)
f
T
C
cb
C
rb
rb′C
c
MHz
650
−
−
−
−
−
−
−
−
0.7
0.65
9.0
pF
pF
ps
h
FE
V
CE(sat)
V
BE
−
60
−
−
−
−
−
−
0.5
0.95
Vdc
Vdc
V
(BR)CEO
V
(BR)CBO
V
(BR)EBO
I
CBO
I
EBO
25
30
3.0
−
−
−
−
−
−
−
−
−
−
100
100
Vdc
Vdc
Vdc
nAdc
nAdc
Symbol
Min
Typ
Max
Unit
http://onsemi.com
2
MMBTH10M3T5G
PACKAGE DIMENSIONS
SOT−723
CASE 631AA−01
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
−X−
b1
D
3
1
2
A
−Y−
E
b
2X
0.08 (0.0032) X Y
L
C
H
E
e
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
DIM
A
b
b1
C
D
E
e
H
E
L
MILLIMETERS
MIN
NOM
MAX
0.45
0.50
0.55
0.15
0.21
0.27
0.25
0.31
0.37
0.07
0.12
0.17
1.15
1.20
1.25
0.75
0.80
0.85
0.40 BSC
1.15
1.20
1.25
0.15
0.20
0.25
INCHES
MIN
NOM
MAX
0.018 0.020 0.022
0.0059 0.0083 0.0106
0.010 0.012 0.015
0.0028 0.0047 0.0067
0.045 0.047 0.049
0.03 0.032 0.034
0.016 BSC
0.045 0.047 0.049
0.0059 0.0079 0.0098
SOLDERING FOOTPRINT*
0.40
0.0157
0.40
0.0157
1.0
0.039
0.40
0.0157
0.40
0.0157
0.40
0.0157
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
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5
MMBTH10M3/D
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