*Customer:
Pb Free
SPECIFICATION
ITEM
MODEL
REVISION DATE
CHIP LED DEVICE
BW104-S
Rev1.0(070102)
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Soldering profile
5. Outline dimension
6. Reel packing structure
7. Packing
8. Precaution for use
9. Label
10.
Rank
Customer
Approved by
Approved by
Approved by
Supplier
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
Seoul
SSC-BW104-S
Semiconductor
- 1/9 -
1. Features
Package : 1.6
×
0.8
×
0.4 mm
Color coordinates: X = 0. 21
Tape and reel packing
Y = 0.16
according to CIE 1931
2. Absolute maximum ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
P
d
I
F
I
FM*1
V
R
T
opr
T
stg
Value
99
30
100
5
-30 ~ 80
-40 ~ 100
(Ta=25℃)
Unit
½
㎃
㎃
V
℃
℃
*1 I
FM
conditions: Pulse width Tw≤ 0.1ms, Duty ratio≤ 1/10
3. Electro-optical characteristics
Characteristics
Forward Voltage
Reverse Current
Luminous Intensity
*2
Chromaticity Coordinates
*3
Symbol
V
F
I
R
I
V
X
Y
Condition
I
F
=5㎃
V
R
=5V
I
F
=5㎃
I
F
=5㎃
I
F
=5㎃
I
F
=5㎃
Min
2.7
-
25
0.165
0.115
-
Typ
2.9
-
45
0.210
0.160
Y =±80
(Ta=25℃)
Max
3.1
10
81
0.260
0.205
-
˚
Unit
V
㎂
mcd
Viewing Angle
: Y Direction
Δ
1/2
θ
*2 The luminous intensity I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3 The CIE standard colorimetric system
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-BW104-S
- 2/9 -
[Note] ( Tolerance : IV±10%, color coordinate
±0.01,
V
F
±0.1
)
4. Soldering profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
°C
Operation heating
240
150
~
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
LED Surface temperature
°C
Operation heating
260
150
~
120
0
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
60 to 120 sec.
5 to 10 sec.
(3) Hand Solder
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-BW104-S
- 3/9 -
-Not more than 3 seconds @MAX280℃, under Soldering iron.
5. Outline dimension
Tolerance:
±0.1,
0.3
0.18
Resin
1.1
1.6
1.2
Polarity Mark
Unit:
㎜
Cathode
0.8
2.4
PCB
0.3
0.8
0.4
±0.05
Anode
0.8
[Recommended Solder Pattern]
6. Reel packing structure
1.5
+0.1
-0
±0.05
1.85
±0.05
1.75
2.0
±0.05
±0.1
4.0
±0.1
0.2
±0.05
3.5
(2.75)
4.0
±0.1
0.5
±0.08
0.95
±0.05
8.0
±0.2
0.5
±0.05
180
+0
-3
11.4
9
±0.3
2
±0.2
+0.2
-0
22
13
±0.2
Label
60
Tolerance
±0.2,
Unit : mm
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be
±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10℃ angle to be the carrier tape
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-BW104-S
- 4/9 -
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
7. Packing
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-BW104-S
- 5/9 -
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