IC,MEMORY CONTROLLER,CMOS,PGA,124PIN
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) |
| 包装说明 | PGA, PGA124,13X13 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-PPGA-P124 |
| JESD-609代码 | e0 |
| 端子数量 | 124 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | PGA |
| 封装等效代码 | PGA124,13X13 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 100 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| NSBMC290UP-16 | NSBMC290VF-16 | NSBMC290VF-20 | NSBMC290VF-25 | NSBMC290UP-33 | NSBMC290UP-25 | NSBMC290UP-20 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,MEMORY CONTROLLER,CMOS,PGA,124PIN | IC DRAM CONTROLLER, PQFP132, PLASTIC, QFP-132, Memory Controller | IC DRAM CONTROLLER, PQFP132, PLASTIC, QFP-132, Memory Controller | IC DRAM CONTROLLER, PQFP132, PLASTIC, QFP-132, Memory Controller | IC,MEMORY CONTROLLER,CMOS,PGA,124PIN | IC,MEMORY CONTROLLER,CMOS,PGA,124PIN | IC,MEMORY CONTROLLER,CMOS,PGA,124PIN |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| 包装说明 | PGA, PGA124,13X13 | BQFP, SPQFP132,1.1SQ | BQFP, SPQFP132,1.1SQ | BQFP, SPQFP132,1.1SQ | PGA, PGA124,13X13 | PGA, PGA124,13X13 | PGA, PGA124,13X13 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-PPGA-P124 | S-PQFP-G132 | S-PQFP-G132 | S-PQFP-G132 | S-PPGA-P124 | S-PPGA-P124 | S-PPGA-P124 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 124 | 132 | 132 | 132 | 124 | 124 | 124 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | PGA | BQFP | BQFP | BQFP | PGA | PGA | PGA |
| 封装等效代码 | PGA124,13X13 | SPQFP132,1.1SQ | SPQFP132,1.1SQ | SPQFP132,1.1SQ | PGA124,13X13 | PGA124,13X13 | PGA124,13X13 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | FLATPACK, BUMPER | FLATPACK, BUMPER | FLATPACK, BUMPER | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | GULL WING | GULL WING | GULL WING | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 0.64 mm | 0.64 mm | 0.64 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | QUAD | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
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