INTERCONNECTS
.050” Grid
Single and Double Row
(Number of Pins
X .050”) + .015”
Series 850, 851
852, 853
•
Series 850 single and double row
interconnects have .050” pin
spacing and permit board stacking
as low as .248”.
•
Pin headers have .016” dia. pins.
(MM# 4006-0 see page 166 for details).
•
MM# 0489-0 and 0467 receptacles
use M-M#11 Hi-Rel, 3-finger beryl-
lium copper contacts rated at 3 amps.
(#11 contact accepts pin diameters
from .015-.020)
•
Insulators are high temp. thermo-
plastic, suitable for all soldering
operations.
Fig. 1
(Number of Pins
X .050”/2) + .015”
Ordering Information
Single Row
Fig. 1
Fig. 2
(Number of Pins
X .050”) + .015”
.087” Profile Pin Header
850-XX-0_ _-10-001000
01-50
.075” Profile Pin Header
852-XX-_ _ _-10-001000
002-100
Specify # of pins
Double Row
Fig. 2
Specify # of pins
XX= Plating Code
See Below
SPECIFY PLATING CODE XX=
10
10μ” Au
90
200μ” Sn/Pb
40
200μ” Sn
Fig. 3
(Number of Pins
X .050”/2) + .015”
Pin Plating
Single Row
.161” Profile Socket
851-XX-0_ _-10-001000
01-50
Fig. 3
Specify # of pins
Fig. 4
Fig. 4
(Number of Pins
X .050”) + .040”
Double Row
.161” Profile Socket
853-XX-_ _ _-10-001000
Specify # of pins
Single Row
002-100
.185” Profile Socket
851-XX-0_ _-10-002000
Specify # of pins
XX= Plating Code
See Below
Fig. 5
01-77
SPECIFY PLATING CODE XX=
13
10µ” Au
30µ” Au
91
10µ” Au
93
30µ” Au
99
200µ”Sn/Pb
41
10µ” Au
43
44
Sleeve (Pin)
200µ” Sn/Pb
200µ” Sn/Pb 200µ”Sn/Pb
200µ”Sn
200µ”Sn 200µ”Sn
30µ” Au 200µ”Sn
Fig. 5
Contact (Clip)
w w w. m i l l - m a x . c o m
70
516-922-6000
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
