SPST, 4 Func, 1 Channel, DIE
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIE |
| 包装说明 | DIE, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-XUUC-N16 |
| JESD-609代码 | e0 |
| 负电源电压最大值（Vsup） | -20 V |
| 负电源电压最小值（Vsup） | -5 V |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 85 Ω |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 20 V |
| 最小供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| MXDG445C/D | MXDG444DY | MXDG444DJ | MXDG445DJ | MXDG444AK | MXDG445DY | MXDG445AK | MXDG444C/D | MXDG445DK | MXDG444DK | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | SPST, 4 Func, 1 Channel, DIE | SPST, 4 Func, 1 Channel, PDSO16, SO-16 | SPST, 4 Func, 1 Channel, PDIP16, PLASTIC, DIP-16 | SPST, 4 Func, 1 Channel, PDIP16, PLASTIC, DIP-16 | SPST, 4 Func, 1 Channel, CDIP16, CERDIP-16 | SPST, 4 Func, 1 Channel, PDSO16, SO-16 | SPST, 4 Func, 1 Channel, CDIP16, CERDIP-16 | SPST, 4 Func, 1 Channel, DIE | SPST, 4 Func, 1 Channel, CDIP16, CERDIP-16 | SPST, 4 Func, 1 Channel, CDIP16, CERDIP-16 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIE | SOIC | DIP | DIP | DIP | SOIC | DIP | DIE | DIP | DIP |
| 包装说明 | DIE, | SOP, | DIP, | DIP, | DIP, | SOP, | DIP, | DIE, | DIP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-XUUC-N16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-GDIP-T16 | R-XUUC-N16 | R-GDIP-T16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负电源电压最大值（Vsup） | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V |
| 负电源电压最小值（Vsup） | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 85 Ω | 85 Ω | 85 Ω | 85 Ω | 85 Ω | 85 Ω | 85 Ω | 85 Ω | 85 Ω | 85 Ω |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C | - | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIE | SOP | DIP | DIP | DIP | SOP | DIP | DIE | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
| 最小供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO | YES | NO | YES | NO | NO |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 座面最大高度 | - | 1.75 mm | 4.572 mm | 4.572 mm | 5.842 mm | 1.75 mm | 5.842 mm | - | 5.842 mm | 5.842 mm |
| 端子节距 | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 宽度 | - | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm | 7.62 mm | - | 7.62 mm | 7.62 mm |
51单片机
微控制器 MCU
聊聊、笑笑、闹闹
单片机
嵌入式系统
嵌入式系统
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