SIPO Based Peripheral Driver, CMOS, PQCC68, PLASTIC, QFP-68
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Supertex |
零件包装代码 | QFP |
包装说明 | QCCJ, |
针数 | 68 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
输入特性 | STANDARD |
接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER |
JESD-30 代码 | S-PQCC-J68 |
功能数量 | 1 |
端子数量 | 68 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | TOTEM-POLE |
输出电流流向 | SOURCE AND SINK |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
认证状态 | Not Qualified |
最大压摆率 | 25 mA |
标称供电电压 | 5 V |
电源电压1-最大 | 36 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子位置 | QUAD |
断开时间 | 2 µs |
接通时间 | 2 µs |
HV3304PJ | HV3304DJ | RBHV3304DJ | HV3304X | |
---|---|---|---|---|
描述 | SIPO Based Peripheral Driver, CMOS, PQCC68, PLASTIC, QFP-68 | SIPO Based Peripheral Driver, CMOS, CQCC68, CERAMIC, QFP-68 | SIPO Based Peripheral Driver, CMOS, CQCC68, CERAMIC, QFP-68 | SIPO Based Peripheral Driver, CMOS, DIE-67 |
厂商名称 | Supertex | Supertex | Supertex | Supertex |
零件包装代码 | QFP | QFP | QFP | DIE |
包装说明 | QCCJ, | QCCJ, | QCCJ, | DIE, |
针数 | 68 | 68 | 68 | 67 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
输入特性 | STANDARD | STANDARD | STANDARD | STANDARD |
接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER |
JESD-30 代码 | S-PQCC-J68 | S-CQCC-J68 | S-CQCC-J68 | R-XUUC-N67 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 67 |
最高工作温度 | 70 °C | 85 °C | 125 °C | 70 °C |
输出特性 | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE |
输出电流流向 | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
封装代码 | QCCJ | QCCJ | QCCJ | DIE |
封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | UNCASED CHIP |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 25 mA | 25 mA | 25 mA | 25 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
电源电压1-最大 | 36 V | 36 V | 36 V | 36 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | MILITARY | COMMERCIAL |
端子形式 | J BEND | J BEND | J BEND | NO LEAD |
端子位置 | QUAD | QUAD | QUAD | UPPER |
断开时间 | 2 µs | 2 µs | 2 µs | 2 µs |
接通时间 | 2 µs | 2 µs | 2 µs | 2 µs |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - |
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