Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDFP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 频率补偿 | NO |
| 最大输入失调电压 | 3000 µV |
| JESD-30 代码 | R-XDFP-F16 |
| JESD-609代码 | e0 |
| 低-失调 | NO |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | +-15/+-20 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| LH2101AF/883 | LH2101AD/883 | LH2101AF/883B | 5962-01-017-8412 | |
|---|---|---|---|---|
| 描述 | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDFP16 | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDIP16 | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDFP16 | Operational Amplifier, 2 Func, 3000uV Offset-Max, BIPolar, CDFP16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | DFP | DIP | DFP | DFP |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 频率补偿 | NO | NO | NO | NO |
| 最大输入失调电压 | 3000 µV | 3000 µV | 3000 µV | 3000 µV |
| JESD-30 代码 | R-XDFP-F16 | R-XDIP-T16 | R-XDFP-F16 | R-XDFP-F16 |
| 低-失调 | NO | NO | NO | NO |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -25 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | DIP | DFP | DFP |
| 封装等效代码 | FL16,.3 | DIP16,.3 | FL16,.3 | FL16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | FLATPACK |
| 电源 | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | OTHER |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| JESD-609代码 | e0 | e0 | e0 | - |
| 筛选级别 | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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