32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PBGA81, 10 X 10 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-81
参数名称 | 属性值 |
是否无铅 | 不含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | BGA |
包装说明 | LBGA, |
针数 | 81 |
Reach Compliance Code | unknown |
具有ADC | YES |
地址总线宽度 | |
位大小 | 32 |
最大时钟频率 | 80 MHz |
DAC 通道 | NO |
DMA 通道 | YES |
外部数据总线宽度 | |
JESD-30 代码 | S-PBGA-B81 |
JESD-609代码 | e3 |
长度 | 10 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 56 |
端子数量 | 81 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度) | 260 |
ROM可编程性 | FLASH |
座面最大高度 | 1.6 mm |
速度 | 66 MHz |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
MCF52221CVM66 | MCF52223CAF66 | MCF52223CAF80 | MCF52223CVM66 | MCF52223CVM80 | MCF52221CAF80 | MCF52221CAE66 | MCF52221CAF66 | MCF52221CVM80 | |
---|---|---|---|---|---|---|---|---|---|
描述 | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PBGA81, 10 X 10 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-81 | 32-BIT, FLASH, 80MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 32-BIT, FLASH, 80MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA81, 10 X 10 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-81 | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA81, 10 X 10 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-81 | 32-BIT, FLASH, 66MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BCD, LQFP-64 | 32-BIT, FLASH, 66MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PBGA81, 10 X 10 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-81 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | BGA | QFP | QFP | BGA | BGA | QFP | QFP | QFP | BGA |
包装说明 | LBGA, | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | LBGA, | LBGA, | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | LFQFP, | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | LBGA, |
针数 | 81 | 100 | 100 | 81 | 81 | 100 | 64 | 100 | 81 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
具有ADC | YES | YES | YES | YES | YES | YES | YES | YES | YES |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
最大时钟频率 | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B81 | S-PQFP-G100 | S-PQFP-G100 | S-PBGA-B81 | S-PBGA-B81 | S-PQFP-G100 | S-PQFP-G64 | S-PQFP-G100 | S-PBGA-B81 |
JESD-609代码 | e3 | e3 | e3 | e3 | e1 | e3 | e3 | e3 | e1 |
长度 | 10 mm | 14 mm | 14 mm | 10 mm | 10 mm | 14 mm | 10 mm | 14 mm | 10 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
I/O 线路数量 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
端子数量 | 81 | 100 | 100 | 81 | 81 | 100 | 64 | 100 | 81 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LFQFP | LFQFP | LBGA | LBGA | LFQFP | LFQFP | LFQFP | LBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.6 mm | 1.7 mm | 1.7 mm | 1.6 mm | 1.6 mm | 1.7 mm | 1.6 mm | 1.7 mm | 1.6 mm |
速度 | 66 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | TIN SILVER COPPER | MATTE TIN | MATTE TIN | MATTE TIN | TIN SILVER COPPER |
端子形式 | BALL | GULL WING | GULL WING | BALL | BALL | GULL WING | GULL WING | GULL WING | BALL |
端子节距 | 1 mm | 0.5 mm | 0.5 mm | 1 mm | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1 mm |
端子位置 | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM | QUAD | QUAD | QUAD | BOTTOM |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
宽度 | 10 mm | 14 mm | 14 mm | 10 mm | 10 mm | 14 mm | 10 mm | 14 mm | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved