INTERCONNECTS
OFP® Pass Thru Sockets for Ø.030” &
Single and Double Row
•
834/835 Series Pass Thru Sockets have a low
.130” profile and will accept Ø.030” round pin,
as well as industry standard .025” square pin
headers.
•
They are typically used to interconnect two or
more parallel circuit boards.
•
Sockets are designed for hand, wave or reflow*
soldering. The high temp. insulator is compati-
ble with all solder processes.
•
Unique
ORGANIC FIBRE PLUG®
barriers pre-
vent solder, paste or flux from contaminating
the internal spring contacts. After soldering, the
OFP®
barriers are pushed out of the socket
when the mating header is inserted.
•
Mill-Max sockets use a precision machined
brass sleeve with a press-fit beryllium copper
“multi-finger” spring contact.
•
Recommended mounting holes are Ø.046
±.003” PTH (1,2 mm drilled prior to plating).
*Intrusive reflow (also called "pin-in-paste") is a tech-
nique of using conventional thru-hole components
in a reflow soldering process. The pass thru socket
is placed into plated-thru-holes in the circuit board
(solder paste has previously been screen printed on
pads adjacent to the holes) and the board is
reflowed in the same pass as other SMT compo-
nents. Solder will fill the plated-thru-holes and
achieve solder joints as reliable as wave soldering.
The OFP® barrier prevents solder paste from being
picked-up inside the contact during assembly.
Series 834, 835
.025” pins
Typical Application
U
Patent Pending
Ordering Information
Single Row
OFP® Pass Thru Socket
834-XX-0 _ _-10-001
01-64
Fig. 1
®
Specify # of pins
Fig. 1
Double Row OFP® Pass Thru Socket
835-XX-0 _ _-10-001
Fig. 2
Specify # of pins
XX= Plating Code
See Below
SPECIFY PLATING CODE XX=
®
02-72
93
30μ” Au
99
200μ”Sn/Pb
Sleeve (Pin)
200μ” Sn/Pb 200μ”Sn/Pb
Fig. 2
Contact (Clip)
(6/04 - 550, 547, 535, 529)
w w w. m i l l - m a x . c o m
516-922-6000
PR
E
CI
PIN RECEPTACLES
With Organic Fibre Plug® Solder Barrier
• These thru-hole (tubular) receptacles are designed for hand,
wave or reflow* soldering. The
ORGANIC FIBRE PLUG®
barrier prevents solder, paste or flux from contaminating the
spring contact.
• After soldering, the
OFP®
barrier is pushed out of the recep-
tacle when the device is plugged in.
• All parts are available as discrete receptacles; but for SMT
assembly, certain receptacles are supplied on carrier tape
per EIA-481 to feed industry standard pick and place
machines.
M
ON
S
I
CHI
A
PINS
*Intrusive reflow (also called "pin-in-paste") is a technique of using conven-
tional thru-hole components in a reflow soldering process. The receptacles
are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed on pads adjacent to the
holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-thru-holes and achieve
solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked-up inside the contact
during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume of paste required to fill
each hole.
NE
D
5359
.048 DIA.
.038 DIA.
.010
.060
.071
0577
4015
.068 DIA.
.052 DIA.
.020
.089 .100
4280
.078 DIA.
.062 DIA.
.020
.089
.100
.056 DIA.
.028 DIA.
.009
.043 DIA.
.009
.051 DIA.
.009
5359-0-43-01-10-27-10-0
Solder mount in Ø.043±.003 PTH.
#10
Contact for Ø.012-.017 pins.
0577-0-43-01-21-27-10-0
Solder mount in Ø.045±.003 PTH.
#21
Contact for Ø.015-.022 pins.
4015-0-XX-01-30-27-10-0
4280-0-XX-01-16-27-10-0
Solder mount in Ø.057±.003 PTH. Solder mount in Ø.067±.003 PTH.
#30
Contact for Ø.015-.025 pins.
#16
Contact for Ø.022-.034 pins.
Also available on 8mm wide carrier Also available on 8mm wide carrier
tape: 5,500 parts per 13” reel.
tape: 5,500 parts per 13” reel.
0479
0379
.090 DIA.
.072 DIA.
.018
.125
.206
9873
.100 DIA.
.078 DIA.
.030
5364
.120 DIA.
.110
.018 .125
.150
.093
.125
.098 DIA.
.075 DIA.
.068 DIA.
.009
.067 DIA.
.009
.064 DIA.
.009
0479-0-XX-01-34-27-10-0
0379-0-43-01-34-27-10-0
9873-0-XX-01-02-27-10-0
5364-0-XX-01-23-27-10-0
Solder mount in Ø.077±.003 PTH. Solder mount in Ø.077±.003 PTH. Solder mount in Ø.083±.003 PTH. Solder mount in Ø.103±.003 PTH.
#02
Contact for Ø.040-.050 pins.
#23
Contact for Ø.045-.065 pins.
#34
Contact for Ø.032-.046 pins.
#34
Contact for Ø.032-.046 pins.
Also available on 12mm wide carrier Also available on 12mm wide carrier
Also available on 16mm wide carrier
tape: 4,500 parts per 13” reel.
tape: 2,000 parts per 13” reel.
tape: 2,500 parts per 13” reel.
SPECIFICATIONS
SHELL MATERIAL:
Brass Alloy 360, 1/2 Hard
CONTACT MATERIAL:
Beryllium Copper Alloy 172, HT
SOLDER BARRIER:
Organic Fibre Plug™
DIMENSION IN INCHES
TOLERANCES ON:
LENGTHS:
±.005
DIAMETERS: ±.002
ANGLES:
± 2°
ORDER CODE: XXXX - 0 - XX - 01 - XX - XX -10 - 0
BASIC PART #
SPECIFY PACKAGING:
43
Discrete receptacles
67
Tape & Reel for SMT
SHELL FINISH:
01
200μ" TIN/LEAD OVER NICKEL
SPECIFY CONTACT FINISH:
01
200μ" TIN/LEAD OVER NICKEL
27
30μ" GOLD OVER NICKEL
CONTACT #
Receptacles can be assembled with a choice of
contacts, see page 203 for alternates available.
w w w. m i l l - m a x . c o m
516-922-6000
NXP MCU
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