Switching Diodes
2SK1035
MA1U157A
Silicon epitaxial planer type
For switching circuits
s
Features
q
2.8±0.2
0.65±0.15
1.5
–0.05
+0.25
Unit : mm
0.65±0.15
Package thickness as small as 0.7mm, most favorite for thinning of
2.9±0.1
M
Di ain
sc te
on na
tin nc
ue e/
d
0.95
q
in the high-speed mounting machine
Short reverse recovery period t
rr
Small capacity between pins, C
t
Series connection type
q
q
q
2
s
Absolute Maximum Ratings
(Ta= 25˚C)
Parameter
Symbol
V
R
V
RM
I
F
Reverse voltage (DC)
Peak reverse voltage
Forward current (DC)
Single
Series
Series
Series
Single
Single
Peak forward current
Non-repetitive peak
forward surge current
Storage temperature
I
FM
I
FSM
*
Junction temperature
T
j
* t=1s
/D
isc
s
Electrical Characteristics
(Ta= 25˚C)
on
tin
ue
di
T
stg
– 55 to +150
ce
Parameter
Symbol
I
R
V
F
V
R
C
t
t
rr
*
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0.7
–0
+0.1
Rating
80
80
65
Unit
V
V
1 : Anode 1
2 : Cathode 2
3 : Cathode 1
3ÅAnode
2
T-Mini Type Package (3-pin)
100
225
145
500
325
150
Marking Symbol : MS
mA
mA
mA
˚C
˚C
s
Internal Connection
1
2
3
Condition
min
typ
max
0.1
1.2
2
3
0.4
–0.05
Flat lead type, with improved mounting efficiency and solderability
1.9±0.1
0.95
equipment
1
+0.1
3
Unit
µA
V
V
pF
ns
Ma
int
en
an
Reverse current (DC)
Forward voltage (DC)
Reverse voltage (DC)
Terminal capacitance
V
R
= 75V
I
F
=100mA
I
R
=100µA
80
V
R
= 0V, f=1MHz
I
rr
= 0.1 · I
R,
R
L
=100Ω
Note 1 : Rated input/output frequency : 100MHz
2 : * t
rr
measuring circuit
Pl
Reverse recovery time
I
F
=10mA, V
R
= 6V
s
Marking
Bias Insertion
Unit N-50BU
t
r
10%
Input Pulse
t
p
t
I
F
t
rr
t
Output Pulse
MS
A
V
R
Pulse Generator
PG-10N
R
s
=50Ω
W.F.Analyzer
SAS-8130
R
i
=50Ω
90%
t
p
=2µs
t
r
=0.35ns
δ=0.05
I
rr
=0.1 · I
R
I
F
=10mA
V
R
=6V
R
L
=100Ω
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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Microchip MCU
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