Datasheet> 器件分类 > 模拟混合信号IC> 信号电路> SI8660BD-A-IS

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SI8660BD-A-IS: 产品描述Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, SOIC-16; 产品类别模拟混合信号IC 信号电路; 文件大小451KB，共36页; 制造商Silicon Laboratories Inc; 标准

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SI8660BD-A-IS概述

Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, SOIC-16

SI8660BD-A-IS规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Silicon Laboratories Inc
零件包装代码	SOIC
包装说明	SOP, SOP16,.4
针数	16
Reach Compliance Code	unknown
模拟集成电路 - 其他类型	ANALOG CIRCUIT
JESD-30 代码	R-PDSO-G16
长度	10.3 mm
湿度敏感等级	3
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP16,.4
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
峰值回流温度（摄氏度）	260
电源	2.5/5 V
认证状态	Not Qualified
座面最大高度	2.65 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
宽度	7.5 mm

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Si8660/61/62/63

O W

O W E R

I X

- C

HANNEL

IGITA L

SOLATOR

Features



High-speed operation



DC to 150 Mbps



No start-up initialization required



Wide Operating Supply Voltage



2.5–5.5 V



Up to 5000 V

RMS

isolation



60-year life at rated working voltage



High electromagnetic immunity



Ultra low power (typical)

5 V Operation



1.6 mA per channel at 1 Mbps



5.5 mA per channel at 100 Mbps

2.5 V Operation



1.5 mA per channel at 1 Mbps



3.5 mA per channel at 100 Mbps



Schmitt trigger inputs



Selectable fail-safe mode



Default high or low output

(ordering option)

Precise timing (typical)



10 ns propagation delay



1.5 ns pulse width distortion



0.5 ns channel-channel skew



2 ns propagation delay skew



5 ns minimum pulse width

Transient Immunity 50 kV/µs

AEC-Q100 qualification

Wide temperature range



–40 to 125 °C

RoHS-compliant packages



SOIC-16 wide body



SOIC-16 narrow body

Applications



Industrial automation systems

Medical electronics

Hybrid electric vehicles

Isolated switch mode supplies



Isolated ADC, DAC

Motor control

Power inverters

Communication systems

Ordering Information:

See page 26.

Safety Regulatory Approvals



UL 1577 recognized



Up to 5000 V

RMS

for 1 minute

CSA component notice 5A approval



IEC 60950-1, 61010-1, 60601-1

(reinforced

insulation)



VDE certification conformity



IEC 60747-5-2

(VDE0884 Part 2)



EN60950-1

(reinforced insulation)

Description

Silicon Lab's family of ultra-low-power digital isolators are CMOS devices

offering substantial data rate, propagation delay, power, size, reliability, and

external BOM advantages over legacy isolation technologies. The operating

parameters of these products remain stable across wide temperature ranges

and throughout device service life for ease of design and highly uniform

performance. All device versions have Schmitt trigger inputs for high noise

immunity and only require VDD bypass capacitors.

Data rates up to 150 Mbps are supported, and all devices achieve propagation

delays of less than 10 ns. Ordering options include a choice of isolation ratings

(3.75 and 5 kV) and a selectable fail-safe operating mode to control the default

output state during power loss. All products >1 kV

RMS

are safety certified by

UL, CSA, and VDE, and products in wide-body packages support reinforced

insulation withstanding up to 5 kV

RMS

Rev. 1.3 3/12

Si8660/61/62/63

Si8660/61/62/63

ABLE O F

ONTENTS

Section

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.1. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.2. Eye Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.1. Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

3.2. Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.3. Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.4. Fail-Safe Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.5. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

4. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6. Package Outline: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

7. Land Pattern: 16-Pin Wide-Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

8. Package Outline: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

9. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

10. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

10.1. Si866x Top Marking (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

10.2. Top Marking Explanation (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . 33

10.3. Si866x Top Marking (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . 34

10.4. Top Marking Explanation (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . 34

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Rev. 1.3

SI8660BD-A-IS相似产品对比

	SI8660BD-A-IS	SI8660BC-A-IS1	SI8663BD-A-IS	SI8661BC-A-IS1	SI8660EC-A-IS1	SI8662EC-A-IS1	SI8661BD-A-IS	SI8661EC-A-IS1	SI8661ED-A-IS	SI8660ED-A-IS
描述	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, MS-012AC, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, MS-012AC, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, MS-012AC, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, MS-012AC, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, MS-012AC, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, SOIC-16	Analog Circuit, 1 Func, CMOS, PDSO16, ROHS COMPLIANT, SOIC-16
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
包装说明	SOP, SOP16,.4	SOP, SOP16,.25	SOP, SOP16,.4	SOP, SOP16,.25	SOP, SOP16,.25	SOP, SOP16,.25	SOP, SOP16,.4	SOP, SOP16,.25	SOP, SOP16,.4	SOP, SOP16,.4
针数	16	16	16	16	16	16	16	16	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
模拟集成电路 - 其他类型	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
长度	10.3 mm	9.9 mm	10.3 mm	9.9 mm	9.9 mm	9.9 mm	10.3 mm	9.9 mm	10.3 mm	10.3 mm
湿度敏感等级	3	2A	3	2A	2A	2A	3	2A	3	3
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	16	16	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	SOP	SOP	SOP	SOP	SOP	SOP	SOP	SOP
封装等效代码	SOP16,.4	SOP16,.25	SOP16,.4	SOP16,.25	SOP16,.25	SOP16,.25	SOP16,.4	SOP16,.25	SOP16,.4	SOP16,.4
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260	260
电源	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.65 mm	1.75 mm	2.65 mm	1.75 mm	1.75 mm	1.75 mm	2.65 mm	1.75 mm	2.65 mm	2.65 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	40	40	40	40	40	40	40	40	40	40
宽度	7.5 mm	3.9 mm	7.5 mm	3.9 mm	3.9 mm	3.9 mm	7.5 mm	3.9 mm	7.5 mm	7.5 mm
厂商名称	Silicon Laboratories Inc	-	-	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc

SI8660BD-A-IS

SI8660BD-A-IS概述

SI8660BD-A-IS规格参数

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SI8660BD-A-IS相似产品对比

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